Technical Description of TANDBERG MCU with software version D3
D12925 Rev. 03
3
4.4.5.1
Duo Video Interoperability with other vendors ............................................................................................. 29
4.4.6
Custom pictures ...................................................................................................................................... 30
4.5
A
UDIO
F
EATURES
......................................................................................................................................... 31
4.5.1
Audio levelling/ Automatic Gain Control (AGC).................................................................................... 31
4.5.2
Telephone Noise Suppression ................................................................................................................. 31
4.5.3
Custom Sounds........................................................................................................................................ 31
4.5.4
Entry/Exit tones ...................................................................................................................................... 31
4.5.5
Muting of audio ...................................................................................................................................... 31
4.5.6
Telephony................................................................................................................................................ 32
4.5.7
Allow G.728 ............................................................................................................................................ 32
4.5.8
Audio Compression Algorithms .............................................................................................................. 32
4.6
S
YSTEM
M
ANAGEMENT
................................................................................................................................ 33
4.6.1
Ethernet/LAN Interface........................................................................................................................... 33
4.6.2
Platform Requirements ........................................................................................................................... 33
4.6.3
Protocols Supported ............................................................................................................................... 34
4.6.4
System Management Functionality......................................................................................................... 34
4.6.4.1
Remote software upgrades using FTP: .......................................................................................................... 34
4.6.4.2
Management using a standard Web-browser: ................................................................................................ 34
4.6.4.3
Management using a standard Telnet-client: ................................................................................................. 35
4.6.4.4
Management using a terminal connected to the RS232 port:......................................................................... 35
4.6.5
Security ................................................................................................................................................... 35
4.6.5.1
HTTPS, TLS/SSL.......................................................................................................................................... 35
4.6.5.2
Disable Services............................................................................................................................................. 36
4.6.5.3
Security Alert................................................................................................................................................. 36
4.6.5.4
Authentication of Remote Management System – (Telnet Challenge) .......................................................... 36
4.6.6
Layer 4 ports used by the system ............................................................................................................ 37
5
MISCELLANEOUS FEATURES................................................................................................................. 38
5.1
D
ISTRIBUTED
MCU
S
.................................................................................................................................... 38
5.2
P
HONE BOOK
................................................................................................................................................ 39
5.2.1
Group Entries ......................................................................................................................................... 39
5.3
M
AXIMUM MEETING DURATION
.................................................................................................................... 39
5.4
F
ILE SYSTEM
(FTP) ...................................................................................................................................... 39
5.4.1
Picture files............................................................................................................................................. 40
5.4.2
Sound files............................................................................................................................................... 40
5.4.3
Other files ............................................................................................................................................... 40
6
ENVIRONMENTAL ISSUES ....................................................................................................................... 41
6.1
TANDBERG’
S
E
NVIRONMENTAL
P
OLICY
................................................................................................... 41
6.2
E
NVIRONMENTAL
C
ONSIDERATIONS
............................................................................................................. 41
7
PRODUCT APPROVALS............................................................................................................................. 42
7.1
C
ONNECTION OF
T
ELE
-T
ERMINAL
E
QUIPMENT
............................................................................................ 42
7.2
EMC E
MISSION
- R
ADIATED
E
LECTROMAGNETIC
I
NTERFERENCE
................................................................ 42
7.3
EMC I
MMUNITY
........................................................................................................................................... 42
7.4
E
LECTRICAL
S
AFETY
.................................................................................................................................... 42
7.5
EMC I
MMUNITY
........................................................................................................................................... 42
7.6
NEBS
APPROVAL
......................................................................................................................................... 43
8
PRODUCT RELIABILITY........................................................................................................................... 43
9
TECHNICAL SPECIFICATION OF TANDBERG MCU ......................................................................... 44
9.1
M
ECHANICAL INFORMATION
......................................................................................................................... 44
9.2
P
ACKAGING
.................................................................................................................................................. 44
9.3
O
PERATING
T
EMPERATURE AND
H
UMIDITY
................................................................................................. 45