Specifications are subject to change without notice
MT5362ANG/B
Approval Datasheet
Page 33 of 35
MEDIATEK CONFIDENTIAL, NO DISCLOSURE
9.3 Thermal
Characteristics
Symbol
Parameters
Value
Unit
Ts
Storage Temperature
-40 to 150
C
Ta
Ambient Temperature
0 to 65
C
Tc
Case Temperature
0 to 95
C
Tjmax
Maximum Junction operation temperature
125
C
jc-BGA-4LPCB
BGA package junction to case thermal resistance on 4 layer PCB
6.5
C/W
ja-BGA-4LPCB
BGA package junction to ambient thermal resistance on 4 Layer PCB
16.3
C/W
PD(estimate) Power
dissipation
4
W
Pdown
Power down mode
66
mW
9.4
DDR2 ELECTRICAL Characteristics and DC Operating
Condition
Symbol
Parameters
Min
Typical
Max
Unit
VCC2IO
DDR I/O supply voltage for DDR2-667/800
1.7
1.8
1.9
V
DVREF
DDR I/O reference voltage
0.49*VCC2IO
0.5*VCC2IO 0.51*VCC2IO
V
VTT
DDR I/O termination voltage
VREF-0.04
VREF
VREF+0.04
V
VIH
DDR input voltage high
VREF+0.125
-
0.3
V
VIL
DDR input voltage low
-0.3
-
VREF-0.125
V
9.5
DDR2 AC Operating Condition
Symbol
Parameters
Min
Typical
Max
Unit
VIH(400, 533)
Input high voltage, DQ, DQS
DVREF+0.25
- -
V
VIL(400, 533)
Input low voltage, DQ, DQS
- -
DVREF-0.25 V
VIH(667, 800)
Input high voltage, DQ, DQS
DVREF+0.20
- -
V
VIL(667, 800)
Input low voltage, DQ, DQS
- -
DVREF-0.20 V
Vslew
Input minimum slew rate
1.0
- -
V/ns
Vswing
Input maximum swing
- -
1.0 V
07.FRQILGHQWLDO
6.
O
yer PCB
16.3
er PCB
16
O
D
4
4
LDO
D
WLD
QWL
D
ECTRICAL Char
CAL Char
ac
F
. FFFRQ
P
RQ
F
VCC2IO DDR
I/
VCC2IO DDR
. F
. FFFFFR
FR
7
F
DVREF
VREF
7.
F
7
F
VTT
VTT
7.
7
V
V
77
)RU7&/2QO\
1.7 1
.7
O\
0.49*VCC2IO
0.5*VCC
2IO
0.5*V
O\
2 O\
VREF-0.04 VR
VREF-0.04 V
2QO\
2 O\
VREF+0.125
VREF+0.
2QO
2 O
e low
-
low
/ 2
Q
&/
2
DDR2 AC Operating C
2 AC Operat
)RU
)RU
Symbol
UU
UU
VIH(400, 533)
Input h
IH(400, 533)
I
)RU
)RUUUUUUU
L(400, 533)
(40
)R
667,
)
1R'LVFORVXUH
VX
VX
Typica
XU
XUH
M
XUH
X
REF+0.25
REF+0.25
-
-
VX
VXXXXXU
XU
R X
-
-
ORV
R
DVREF+0.20
DVREF+0.20
FOR
F R
Q, DQS
QS
LVFO
F
um slew rate
slew rate
'LVF
F
put maximum swing
wing
'LV
'
