PAH300
･
350S24
-SERIES
TDK-Lambda
13
2. Heatsink Installation Method
(1) Method to Fix
(1-1) Standard model and /P option model
To fix the heatsink onto power module, use M3
screws and mount it to the M3 threaded holes
(4 places) at the baseplate side. Recommended
torque is 0.54 N∙m.
(1-2) /T option model and /PT option model
To fix the heatsink onto power module, use M3
screws those are the same screws for mounting power
module onto printed circuit board.
Use silicone grease or thermal conductive sheet in
between heatsink and baseplate to minimize the contact
thermal resistance and to enhance the heat conductivity.
Also use the no-warped heatsink and make sure good
contact between baseplate and heatsink.
(2) Mounting Hole of Heatsink
Recommended mounting hole is as follows.
(2-1) Standard model and /P option model
φ
3.5 Non-threaded hole
(2-2) Standard model and /P option model
M3 Threaded hole
3. Regarding Vibration
The vibration specification of the module is
determined assuming that only the power module is
mounted on printed circuit board. To prevent excessive
force to the module and the printed circuit board, fix
the heatsink to the chassis as well as to the module
when a large size of heastsink is used.
4. Recommended Soldering Method
Recommended soldering conditions are as follows.
(1) Soldering dip
Dip condition : 260ºC within 10 seconds
Pre-heat condition : 110ºC during 30~40 seconds
(2) Soldering iron
φ
1.0 mm : 350ºC (60W) within 3 seconds
φ
2.0 mm : 350ºC (150W) within 20 seconds
※
Soldering time changes according to heat capacity of
soldering iron, pattern on printed circuit board, etc.
Please confirm actual performance.
5. Recommended Cleaning Condition
Recommended cleaning condition after soldering is
as follows.
(1) Cleaning solvent
IPA (isopropyl alcohol )
(2) Cleaning Procedure
Use brush and dry the solvent completely.
