background image

7.

The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP,
CTVS, DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue,
MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine,
SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D,
SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and
in

other

countries.

Further

information

will

be

found

on

the

Internet

at

www.epcos.com/trademarks.

Important notes

Page 25 of 25

Summary of Contents for High-speed Series

Page 1: ...Type Date April 2016 EPCOS AG 2016 Reproduction publication and dissemination of this publication enclosures hereto and the information contained therein without EPCOS prior express consent is prohibi...

Page 2: ...de Case size inch mm 3 0506 1216 4 0508 1220 5 0612 1632 6 1012 2532 Rated voltage Code VDC 040 4 050 5 5 5 6 090 9 120 12 150 15 160 16 180 18 200 20 22 300 30 360 36 480 48 700 70 900 90 201 200 Typ...

Page 3: ...D CeraDiode Rated voltage Code VDC 0040 4 0050 5 5 5 6 0090 9 0120 12 0150 15 0160 16 0180 18 0200 20 22 0300 30 0360 36 0480 48 0700 70 0900 90 0201 200 Type A0 Standard B0 LED H0 High speed H1 Capa...

Page 4: ...era etc EDP products desktop and notebook computer monitor PDA printer memory card control unit head set speaker HDD optical drive etc Industrial applications Mobile phone applications Design Multilay...

Page 5: ...gle 0201 no semiconductor diode equivalent CDS1C05GTH1 B72440C0050H160 5 5 17 33 7 CDS1C05GTH2 B72440C0050H260 5 5 20 66 3 Single 0402 SOD 723 CDS2C05HDMI1 B72590D0050H160 5 6 150 0 6 0 9 CDS2C05HDMI2...

Page 6: ...4 0 13 0 75 Array devices 4 fold array 2 4 data 1 supply Dimension in mm Case size inch mm 0506 1216 0508 1220 0612 1632 1012 2532 Min Max Min Max Min Max Min Max l 1 50 1 70 1 8 2 2 3 0 3 4 2 90 3 50...

Page 7: ...0 8 C 0 3 0 5 1 0 1 45 Array devices 4 fold array 2 4 data 1 supply Dimensions in mm Case size inch mm 0506 1216 0508 1220 0612 1632 1012 2532 A 0 36 0 35 0 5 0 7 B 0 84 0 9 0 7 1 0 C 0 62 0 4 1 2 1 4...

Page 8: ...P1 GND P2 GND P3 GND P4 GND P5 I O line 1 P6 I O line 2 P7 I O line 3 P8 I O line 4 2 4 data 1 supply Pin Description P1 I O line 1 P2 GND P3 I O line 2 P4 I O line 3 P5 VDC P6 I O line 4 CeraDiodes H...

Page 9: ...Termination Single device Array device CeraDiodes High speed series Page 9 of 25 Please read Cautions and warnings and Important notes at the end of this document...

Page 10: ...180 10000 CDS2C16GTH B72590D0160H060 0402 Cardboard 180 10000 CDS2C20GTH B72590D0200H060 0506 Blister 180 3000 CDA3C05GTH B72755D0050H062 0508 Cardboard 180 4000 CDA4C16GTH B72714D0160H060 0603 Cardbo...

Page 11: ...to center compartment P2 2 0 0 05 2 0 2 0 2 0 2 0 0 05 Pitch of component compartments P1 2 0 0 05 2 0 4 0 4 0 4 0 0 1 Tape width W 8 0 0 3 8 0 8 0 8 0 8 0 0 3 Distance edge to center of hole E 1 75...

Page 12: ...0 4 0 0 11 Distance center hole to center compartment P2 2 0 2 0 2 0 0 05 Pitch of component compartments P1 4 0 4 0 4 0 0 1 Tape width W 8 0 8 0 8 0 0 3 Distance edge to center of hole E 1 75 1 75 1...

Page 13: ...cking units Case size inch mm 180 mm reel pieces 330 mm reel pieces Tape 0201 0603 15000 cardboard 0402 1005 10000 50000 cardboard 0603 1608 4000 16000 cardboard 1003 2508 4000 16000 cardboard 0506 12...

Page 14: ...C2 Time tP 3 within 5 C of specified classification temperature Tc 20 s3 30 s3 Average ramp down rate Tp to Tsmax 6 C s max 6 C s max Time 25 C to peak temperature maximum 6 min maximum 8 min 1 Toler...

Page 15: ...omponents on the board It is best to mount the components on the board before soldering so that one termination does not enter the oven first and the second termination is soldered subsequently The id...

Page 16: ...ckel barrier termination Good and poor solder joints caused by amount of solder in infrared reflow soldering CeraDiodes High speed series Page 16 of 25 Please read Cautions and warnings and Important...

Page 17: ...activated flux without preheating at 255 5 C for 10 1 s No leaching of contacts Tests of resistance to soldering heat for SMDs IEC 60068 2 58 Immersion in 60 40 SnPb for 10 s at 260 C Immersion in Sn9...

Page 18: ...pplied smoothly to the end surface to a height of min 0 2 mm 5 5 Selection of flux Used flux should have less than or equal to 0 1 wt of halogenated content since flux residue after soldering could le...

Page 19: ...excessively long soldering time or high soldering temperature results in leaching of the out er electrodes causing poor adhesion due to loss of contact between electrodes and termina tion Avoid manua...

Page 20: ...aximum clamping voltage VDC VRM VRWM VWM VDC Reverse stand off voltage working voltage operating voltage VDC max Maximum DC operating voltage VESD air Air discharge ESD capability VESD contact Contact...

Page 21: ...n if a CeraDiode has insufficient time to cool down between a number of pulses occurring within a specified isolated time period Ensure that elec trical characteristics do not degrade Consider deratin...

Page 22: ...acks to develop on the product and its parts which might lead to reduced reliability or lifetime Mounting When CeraDiodes are encapsulated with sealing material or overmolded with plastic material be...

Page 23: ...ontent EPCOS CeraDiodes are not suitable for switching applications or voltage stabilization where static power dissipation is required This listing does not claim to be complete it merely reflects th...

Page 24: ...ation or other action taken by the customer e g installation of protective circuitry or redundancy that no injury or damage is sustained by third parties in the event of malfunction or failure of an e...

Page 25: ...niCell MKD MKK MotorCap PCC PhaseCap PhaseCube PhaseMod PhiCap PQSine SIFERRIT SIFI SIKOREL SilverCap SIMDAD SiMic SIMID SineFormer SIOV SIP5D SIP5K TFAP ThermoFuse WindCap are trademarks registered o...

Reviews: