Maintenance
—
DM 5010
rate
from
the board base material and melt the insulation
from
small wiring. Always
keep the soldering
iron tip proper
ly tinned to ensure
the
best
heat transfer to the solder joint.
Apply
only enough
heat to remove the component or to
make
a good solder joint.
To
protect heat-sensitive compo
nents,
hold the
component lead with a pair of long-nose
pliers between
the component body and the solder joint.
Use
a solder removing
wick to remove
excess solder from
connections or to clean circuit board pads.
Semiconductors
To remove
in-line integrated circuits mounted in sockets,
use
an extracting tool. This tool is available from Tektronix,
Inc.;
order Tektronix Part
No. 003-0619-00. If an extracting
tool
is not available,
use care to avoid damaging the pins.
Pull
slowly and
evenly on both ends of the integrated circuit.
Try to avoid
disengaging one
end before the other
end.
Exterior
Cleaning
Chassis,
Accumulated
dust on the instrument
chassis
can
be removed with a
soft cloth or small
brush. Remove
dirt that remains
with
a
soft cloth dampened in a mild deter
gent and water solution;
then remove the detergent with a
soft
cloth dampened in clean water. Do not use abrasive
cleaners.
Front
Panel.
Use
only
a cotton
swab or soft cloth,
dampened in isopropyl
alcohol or water.
>
CAUTION <
To avoid
damage, use only isopropyl alcohol or water.
Do
not
use
petroleum based cleaning agents.
Before
using a cleaner other
than isopropyl alcohol, consult
your
Tektronix Service
Center or representative.
Interior
Cleaning
Clean circuit boards
only when required for operation to
specified
performance. Cleaning
and rinsing solutions can
be
used on
all boards except the Front Panel board. The
recommended
cleaning
and rinse solutions, plus specific
cleaning precautions
for
each
board
are listed below by
board name. Observe this board-specific information and
the following general board cleaning information.
General
Board
Cleaning
1. For boards that can be cleaned with a detergent solu
tion,
use only a 20:1 solution of distilled water and Kelite
Spray
White
1
.
’Allied-Kelite
Products Division of
the
Richardson Co.; Los An
geles,
CA.
2. Cleaning after minor repairs to circuit boards can be
done by using
a
soft plastic tool to carefully
chip away flux
residue.
Be careful not to damage circuit board
paths and
components.
3. Do not immerse
boards in cleaning or rinsing solu
tions;
use spray bottles to spray on the specified solutions.
>
CAUTION
(
Rinse
the area extremely well to completely remove
cleaning
residue.
4. After cleaning, use dry, low-velocity air (approximately
5 lb/in
2) to
blow-dry
the board (except the Front Panel
board).
5. To finish board drying, place in an
oven at 40°C to
60°C for
a minimum of twenty-four hours.
To prevent
damage and to ensure proper
operation,
circuit boards and
components must be dry before ap
plying
power.
Board
Cleaning
Front-Panel Board (Al 1).
Do
not
use any
type of
clean
ing
or rinsing solutions, water, or compressed air on this
board,
since cleaning may leave residue and contaminants
inside the switch assemblies or
on the circuit board contact
areas;
interfering with both mechanical and electrical oper
ation.
If
the front-panel
switches are intermittent, then re
place
the switches.
Front-Panel
Drive Board
(A 12).
Use
the detergent
solu
tion
specified
under
General Board Cleaning. Rinse with
isopropyl alcohol or warm
distilled water.
Main
Interconnect Board (A 13).
Use
isopropyl
alcohol
or
the
specified
detergent solution for
cleaning. Rinse very
well
with warm
distilled water or clean isopropyl alcohol.
REV
JAN
1982
7-7
Summary of Contents for DM 5010
Page 14: ...DM 5010 2994 00 DM 5010 Programmable Digital Multimeter xii ADD JUL 1986...
Page 27: ...Operating Instructions DM 5010 2994 03 Fig 2 3 DM 5010 front panel controls and connectors 2 3...
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Page 251: ...Section 8 DM 5010 OPTIONS No options are available 8 1...
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Page 272: ...DM 5010 2994 37 Fig 10 2 Location of DM 5010 adjustments and test points...
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Page 276: ...DM 5010 2994 112 DM 5010 BLOCK DIAGRAM...
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Page 337: ...63 REV JUN 1986...
Page 338: ...FIG 1 EXPLODED DM 5010...
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