S42
Hardware User Guide
1VV0301303 Rev. 11
Page 54 of 85
2021-05-06
Not Subject to NDA
6.3.
Re-flow Temperature-Time Profile
The data here is given only for guidance on solder and must be adapted to your process
and other re-flow parameters for example the used solder paste. The paste
manufacturer provides a re-flow profile recommendation for his product.
Figure 23: Soldering Temperature-Time Profile (for reflow soldering)
Preheat
Main Heat
Peak
tsmax
tLmax
tpmax
Temperature
Time
Temperature
Time
Temperature
Time
[°C]
[sec]
[°C]
[sec]
[°C]
[sec]
150
100
217
90
260
10
230
50
Average ramp-up rate
[°C / sec]
3
Average ramp-down rate
[°C / sec]
6
Max. Time 25°C to Peak
Temperature
[min.]
8
Opposite side re-flow is prohibited due to module weight.
Devices will withstand the specified profile and will withstand up to one re-flows to a
maximum temperature of 260°C. The reflow soldering profile may only be applied if the
S42 resides on the PCB side looking up. Heat above the solder eutectic point
while the S42 is mounted facing down may damage the module permanently.
6.4.
Placement Recommendation
To achieve best radio performance for S42/AI, it is recommended to use the
placement shown in Figure 24
. This is a “corner placement” meaning t
he
S42/AI is placed such that the antenna comes close to the corner of the
