GE864-QUAD Automotive V2 Hardware User Guide
1vv0300840 Rev.0.1 24/11/09
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 4 of 65
9.1.2
Input Lines Characteristics ............................................................................................................ 42
9.2
OUTPUT LINES (Speaker)....................................................................................................43
9.2.1
Short description............................................................................................................................ 43
9.2.2
Output Lines Characteristics.......................................................................................................... 44
10
General Purpose I/O.......................................................................................................45
10.1
GPIO Logic levels .............................................................................................................46
10.2
Using a GPIO Pad as INPUT.............................................................................................47
10.3
Using a GPIO Pad as OUTPUT.........................................................................................47
10.4
Using the RF Transmission Control GPIO4....................................................................47
10.5
Using the RFTXMON Output GPIO5 ................................................................................48
10.6
Using the Alarm Output GPIO6........................................................................................48
10.7
Using the Buzzer Output GPIO7 ......................................................................................48
10.8
Indication of network service availability .......................................................................50
10.9
RTC Bypass out ................................................................................................................51
10.10
External SIM Holder Implementation ..............................................................................51
11
DAC and ADC section....................................................................................................52
11.1
DAC Converter ..................................................................................................................52
11.1.1
Description..................................................................................................................................... 52
11.1.2
Enabling DAC ................................................................................................................................ 53
11.1.3
Low Pass Filter Example ............................................................................................................... 53
11.2
ADC Converter ..................................................................................................................54
11.2.1
Description..................................................................................................................................... 54
11.2.2
Using ADC Converter .................................................................................................................... 54
11.3
Mounting the GE864-QUAD Automotive V2 on your Board..........................................55
11.3.1
General .......................................................................................................................................... 55
11.3.2
Module finishing & dimensions ...................................................................................................... 55
11.3.3
Recommended foot print for the application (GE864) ................................................................... 56
11.3.4
Debug of the GE864 in production ................................................................................................ 57
11.3.5
Stencil ............................................................................................................................................ 57
11.3.6
PCB pad design............................................................................................................................. 58
11.3.7
Solder paste................................................................................................................................... 59
11.3.8
GE864 Solder reflow...................................................................................................................... 60
11.4
Packing system.................................................................................................................61
11.4.1
GE864 orientation on the tray........................................................................................................ 62
11.4.2
Moisture sensibility ........................................................................................................................ 62
12
Conformity Assessment Issues....................................................................................63
13
SAFETY RECOMMANDATIONS.....................................................................................64
14
Document Change Log ..................................................................................................65
