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GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 73 of 79
14.
Packing system
The GL865 modules
are packaged on trays of 20
pieces each. This
is especially suitable for the GL865 according to SMT processes
for pick & place movement requirements.
NOTE:
All temperatures refer to topside of the package, measured on
the package body surface
WARNING:
These trays can withstand at the maximum temperature of 65° C.