JF2 Hardware User Guide
1vv0300985 Rev.4 2013-04-09
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 37 of 40
Mod. 0805 2011-07 Rev.2
12.
Handling and soldering
12.1.
Moisture Sensitivity
The JF2 module has a moisture sensitivity level rating of 3 as defined by IPC/JEDEC J-STD-
020. This rating is assigned due to some of the components used within the JF2.
The JF2 is supplied in trays or tape and reel and is hermetically sealed with desiccant and
humidity indicator card. The JF2 parts must be placed and reflowed within 168 hours of first
opening the hermetic seal provided the factory conditions are less than 30°C and less than
60% and the humidity indicator card indicates less than 10% relative humidity.
If the package has been opened or the humidity indicator card indicates above 10%, then the
parts will need to be baked prior to reflow. The parts may be baked at +125°C ± 5°C for 48
hours. However, the trays, nor the tape and reel can withstand that temperature. Lower
temperature baking is feasible if the humidity level is low and time is available. Please see
IPC/JEDEC J-STD-033 for additional information.
Additional information can be found on the MSL tag affixed to the outside of the hermetical
seal bag.
NOTE:
JEDEC standards are available for free from the JEDEC website http://www.jedec.org.
Figure 3 Label for Moisture Sensitive Devices