SE867-AGPS User Guide
1VV0300860 Rev. 3 - 2010-05-10
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 27 of 69
Value
[mm]
Dimension
Ball pitch
2.4
Solder resist opening diameter A
1,150
Metal PAD diameter B
1 +/- 0,05
Placement of microvias not covered by solder resist is not recommended inside the
inhibit area (1.6 mm - red circle in the picture) unless the microvia carry the same
signal of the pad itself
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish Layer
tickness [um]
Properties
Electro-less Ni /
Immersion Au
3-7 /
0,05-0,15
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures, which are occurring at the
lead-free process.
This issue should be discussed with the PCB-supplier. Generally, the wet-ability of tin-
lead solder paste on the described surface plating is better compared to lead-free
solder paste.
