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WE865-DUAL HW User Guide
1vv0300787
Rev. 1 - 03/10/08
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 40 of 48
10 Mounting the WE865-DUAL on the
application board
The Telit WE865-DUAL module has been designed in order to be compliant with a standard lead-free
SMT process.
10.1 Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil
≥
120
μ
m.
10.2 PCB pad design
"Non solder mask defined” (NSMD) type is recommended for the solder pads on the PCB.
Figure 19