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Introduction

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2

SLUUBL3A – June 2017 – Revised October 2017

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Copyright © 2017, Texas Instruments Incorporated

bq25606 PWR772 Evaluation Module

1

Introduction

1.1

EVM Features

For detailed features and operation, refer to

Table 1

for a list of devices and their data sheets.

Table 1. Device Data Sheets

Device

Data Sheet

EVM Label

Variant

bq25606

SLUSCK6

BQ25606EVM-772

004

The bq25606 evaluation module (EVM) is a standalone charger module without I

2

C control.

1.2

I/O Descriptions

Table 2

lists the jumper connections available on this EVM.

Table 2. EVM Connections

Jack

Description

J1-VAC

Input positive terminal

J1-GND

Ground Input: negative terminal (ground terminal)

J2-PMID

PMID pin connection

J2-GND

Ground

J3

Output mini-USB port

J4-SYS

Connected to system

J4-GND

Ground

J5-BATSNS_ICHG

BATSNS or ICHG pin connection

J5-BAT

Connected to battery pack positive node

J5-GND

Ground

J6

I2C 4-pin connector

J7

USB-TO-GPIO connector (Not populated)

Table 3

lists the EVM jumper connections.

Table 3. EVM Jumper Connections and Shunt Installation

Jack

Description

bq25606 Setting

JP1

PSEL pin selection

Not installed

JP2

CE pin setting: pull low to enable the charge

Installed

JP3

OTG pin setting: pull high to enable OTG mode

Short OTG to GND

JP4

STAT, PG, CE, INT, and OTG pins pullup source (SYS or
BAT)

Short to SYS

JP5

TS pin to GND

Not installed

JP6

TS resistor divider pullup source (REGN) connection

Installed

JP7

Internal 10 k

Ω

to GND to TS pin

Installed

JP8

BATSNS selection

Not installed

JP9

QON and VSET pin setting

Not installed

JP10

STAT pin setting

Installed

JP11

Add SYS cap

Not installed

JP12

SDA and PG pin setting

Installed

JP13

D+ and PSEL to J3

Not Installed

JP14

D– and PG to J3

Not Installed

JP15

D– and PG pin setting

Not installed

JP16

Add VBUS cap

Not installed

Summary of Contents for bq25606

Page 1: ...6 evaluation module unless otherwise noted Contents 1 Introduction 2 1 1 EVM Features 2 1 2 I O Descriptions 2 2 Test Summary 3 2 1 Equipment 3 2 2 Equipment Setup 3 2 3 Test Procedure 5 3 PCB Layout Guideline 6 4 Board Layout 7 5 Schematic 9 6 Bill of Materials 10 List of Figures 1 Original Test Setup for bq25606 EVM 4 2 bq25606EVM Top Overlay 7 3 bq25606EVM Top Solder Mask 7 4 bq25606EVM Top Lay...

Page 2: ...round J5 BATSNS_ICHG BATSNS or ICHG pin connection J5 BAT Connected to battery pack positive node J5 GND Ground J6 I2C 4 pin connector J7 USB TO GPIO connector Not populated Table 3 lists the EVM jumper connections Table 3 EVM Jumper Connections and Shunt Installation Jack Description bq25606 Setting JP1 PSEL pin selection Not installed JP2 CE pin setting pull low to enable the charge Installed JP...

Page 3: ...upply constant voltage 4 5 V A 0 20 V 0 5 A 30 W system DC electronic load and setting as constant voltage load mode or Kepco load BOP 20 5M DC 0 to 20 V 0 to 5 A or higher 3 Load 2 Use with Boost Mode VAC to GND load 10 Ω 5 W or greater 4 Meters Six Fluke 75 multimeters equivalent or better or Four equivalent voltage meters and two equivalent current meters The current meters must be capable of m...

Page 4: ...LUUBL3A June 2017 Revised October 2017 Submit Documentation Feedback Copyright 2017 Texas Instruments Incorporated bq25606 PWR772 Evaluation Module 6 Install shunts as shown in Table 3 Figure 1 Original Test Setup for bq25606 EVM ...

Page 5: ...urrent depending on the voltage sensed at its VBUS pin using the VINDPM feature BAT pin as part of normal termination and TS pin through its battery temperature monitoring feature via battery thermistor Therefore voltmeters must be used to measure the voltage as close to the IC pins as possible instead of relying on the digital readouts of the power supply If a battery thermistor is not available ...

Page 6: ...ther trace or plane 3 Put an output capacitor near to the inductor and the IC Tie ground connections to the IC ground with a short copper trace connection or GND plane 4 Route analog ground separately from the power ground Connect analog ground and connect power ground separately Connect analog ground and power ground together using a power pad as the single ground connection point or use a 0 Ω re...

Page 7: ...edback Copyright 2017 Texas Instruments Incorporated bq25606 PWR772 Evaluation Module 4 Board Layout Figure 2 through Figure 9 show the EVM PCB layout images Figure 2 bq25606EVM Top Overlay Figure 3 bq25606EVM Top Solder Mask Figure 4 bq25606EVM Top Layer Figure 5 bq25606EVM Signal Layer 1 ...

Page 8: ...ber 2017 Submit Documentation Feedback Copyright 2017 Texas Instruments Incorporated bq25606 PWR772 Evaluation Module Figure 6 bq25606EVM Signal Layer 2 Figure 7 bq25606EVM Bottom Layer Figure 8 bq25606EVM Bottom Solder Mask Figure 9 bq25606EVM Bottom Overlay ...

Page 9: ...14 DNP NT1 Net Tie 0 R16 DNP Green D4 REGN RTOP TS PSEL GND REGN CE GND GND OTG TP9 TP8 SYS BAT BAT SYS TP5 REGN BATSNS_ICHG INT_ILIM SCL_OTG TP10 TP11 TS TS TP12 DNP TP13 D _ PG TP14 TP15 QON_VSET D _PSEL TP16 CE TP17 TP18 TP19 TP20 AGND PGND BAT SYS PULLUP AGND 10k ohm R11 PULL UP 1 2 3 4 5 SW3 DNP 1 2 3 4 5 SW4 DNP 1 2 3 4 5 SW2 DNP BAT SYS SW PMID JP13 SCL_OTG 1 2 3 JP9 AGND QON_VSET 1µF C15 0...

Page 10: ... Header 22 05 3041 Molex JP1 JP4 JP9 3 Header 100 mil 3 1 Tin TH Header 3 PIN 100 mil Tin PEC03SAAN Sullins Connector Solutions JP2 JP3 JP5 JP6 JP7 JP10 JP12 JP13 JP14 9 Header 100 mil 2 1 Tin TH Header 2 PIN 100 mil Tin PEC02SAAN Sullins Connector Solutions L2 1 1 µH Inductor 1 µH 3 2 A 0 028 Ω SMD 2 5 2 mm MPIM252010F1R0M LF Microgate LBL1 1 Thermal Transfer Printable Labels 0 650 W 0 200 H 10 0...

Page 11: ...35 V 10 X5R 0603 0603 GMK107BJ105KA T Taiyo Yuden C19 0 10 µF Capacitor ceramic 10 µF 10 V 10 X7R 0805 0805 GRM21BR71A106KE51L Murata D1 0 13 V Diode TVS Uni 13 V W SOD 123W SOD 123W PTVS13VS1UR 115 NXP Semiconductor D2 D7 0 40 V Diode Schottky 40 V 0 38 A SOD 523 SOD 523 ZLLS350TA Diodes Inc D3 D6 0 20 V Diode Schottky 20 V 1 A 152AD 152AD NSR10F20NXT5G ON Semiconductor FID1 FID2 FID3 FID4 FID5 F...

Page 12: ...ue Description Package Reference Part Number Manufacturer Alternate Part Number Alternate Manufacturer SH JP1 SH JP5 SH JP8 SH JP9 SH JP11 SH JP15 SH JP16 SH JP17 SH JP18 0 1 2 Shunt 100 mil Gold plated Black Shunt 969102 0000 DA 3M SNT 100 BK G Samtec SW1 SW2 SW3 SW4 0 Compact Probe Tip Circuit Board Test Points TH 25 per TH Scope Probe 131 5031 00 Tektronix TP12 0 Test Point Miniature White TH W...

Page 13: ...back Copyright 2017 Texas Instruments Incorporated Revision History Revision History NOTE Page numbers for previous revisions may differ from page numbers in the current version Changes from June 2 2017 to September 30 2017 Page Changed Schematic for bq25606EVM 772 9 Changed bq25606EVM 772 BOM 10 ...

Page 14: ... TI Resource NO OTHER LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN including but not limited to any patent right copyright mask work right or other intellectual property right relating to any combination machine or process in which TI product...

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