6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
DD
Supply voltage, V
DD
to A
GND
–0.3
6
V
Digital inputs to A
GND
–0.3
V
DD
+ 0.3
V
CAP to A
GND
–0.3
1.65
V
V
FBX
to A
GND
–0.3
V
DD
+ 0.3
V
V
OUTX
to A
GND
–0.3
V
DD
+ 0.3
V
V
REF
External reference, V
REF
to A
GND
–0.3
V
DD
+ 0.3
V
Current into any pin except the OUTx pins
–10
10
mA
T
J
Junction temperature
–40
150
°C
T
stg
Storage temperature
–65
150
°C
(1)
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
±2000
V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
V
DD
Positive supply voltage to ground (A
GND
)
1.7
5.5
V
V
REF
External reference to ground (A
GND
)
1.7
V
DD
V
V
IH
Digital input high voltage, 1.7 V < V
DD
≤ 5.5 V
1.62
V
V
IL
Digital input low voltage
0.4
V
C
CAP
External capacitor on CAP pin
0.5
15
μF
T
A
Ambient temperature
–40
125
°C
6.4 Thermal Information
THERMAL METRIC
DACx300x
UNIT
RTE (WQFN)
16 PINS
R
θJA
Junction-to-ambient thermal resistance
49
°C/W
R
θJC(top)
Junction-to-case (top) thermal resistance
50
°C/W
R
θJB
Junction-to-board thermal resistance
24.1
°C/W
Ψ
JT
Junction-to-top characterization parameter
1.1
°C/W
Ψ
JB
Junction-to-board characterization parameter
24.1
°C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance
8.7
°C/W
(1)
For information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics application report.
DAC53001, DAC53002, DAC63001, DAC63002
SLASF48 – MAY 2022
4
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