Mechanical Information
7-5
Customer Information
The C614 is sold in die form for its volume production. For software develop-
ment and prototyping, a windowed ceramic 120 pin grid array packaged P614
is available. The P614’s PGA package is shown in Figure 7–2.
Figure 7–2. 120-Pin Grid Array Package for the Development Device, P614
extra pin
1 2 3 4 5 6 7 8 9
N
M
L
K
J
H
G
F
E
D
C
B
A
10 9 8 7 6 5 4 3 2 1
N
M
L
K
J
H
G
F
E
D
C
B
A
(BOTTOM VIEW)
(TOP VIEW)
11
12
13
11 12 13
10
Note:
The PGA package is only available in limited quantities for development
purposes.
Summary of Contents for MSP50C614
Page 1: ...MSP50C614 Mixed Signal Processor User s Guide SPSU014 January 2000 Printed on Recycled Paper ...
Page 6: ...vi ...
Page 92: ...3 22 ...
Page 300: ...Instruction Set Summay 4 208 Assembly Language Instructions ...
Page 314: ...Software Emulator 5 14 Figure 5 13 Project Menu Figure 5 14 Project Open Dialog ...
Page 325: ...Software Emulator 5 25 Code Development Tools Figure 5 25 EPROM Programming Dialog ...
Page 331: ...Software Emulator 5 31 Code Development Tools Figure 5 31 Context Sensitive Help System ...
Page 368: ...5 68 ...
Page 394: ...7 12 ...
Page 402: ...A 8 ...
Page 412: ...Packaging B 10 ...