Board Stackup
3-4
3.3
Board Stackup
9
Copper Foil CH A1
Copper Foil CH A1
.0062 PREPREG
.0062 PREPREG
CORE .015 C1/0 A1
.0122 PREPREG
CORE .015 C0/1 A1
SECTION A - A
NO SCALE
TOP SIDE-SIGNAL/GND FILL (LAYER 1)
INT1-GND PLANE (LAYER 2)
INT2-VCC SPLIT PLANE (LAYER 3)
9
BOTTOM SIDE-GND PLANE (LAYER 4)
Symbol
Diameter (in)
0.0160
0.0320
0.0400
0.0500
0.1250
0.2720
Plated
Yes
Yes
Yes
Yes
Yes
Yes
Quantity
49
8
2
3
4
3
Through Holes
3.000
A
A
3.000
DATUM 0,0
TOP SIDE SHOWN
DRILL
0.250
0.250
N
N
THIS IS AN IMPEDANCE CONTROLLED BOARD.
GENERAL NOTES: UNLESS OTHERWISE SPECIFIED
1. ALL FABRICATION ITEMS MUST MEET OR EXCEED BEST
INDUSTRY PRACTICE. IPC-A 600C ( Commercial Std.)
2.LAMINATE MATERIAL: NELCO N4000-13 (DO NOT USE - 13SI)
3. COOPER WEIGHT:1 OZ. START INTERNAL AND 1/2 OZ. START EXTERNAL
4. FINISHED BOARD THICKNESS: .062
±
10%
5. MAXIMUM WARP AND TWIST TO BE .005 INCH PER INCH
6 MINIMUM COPPER WALL THICKNESS OF PLATED-THRU
HOLES TO BE .001 INCH
7 MINIMUM ANNULAR RING OF PLATED-THRU
HOLES TO BE .002 INCH
8. MINIMUM ALLOWABLE LINE REDUCTION TO BE
20% OR .002 WHICHEVER IS GREATER
9. 0.013 INCH SIGNAL LINES ON LAYER 1 TO BE
IMPEDANCE CONTROLLED 50 OHMS TO GND
±
10%
0.010 INCH SIGNAL LINES ON LAYER 1 TO BE
IMPEDANCE CONTROLLED 100 OHMS TO EACH OTHER
±
10%
10. DIELECTRIC CONSTANTS ARE:
CORE: 3.2
PREPREG:3.2
PROCESS NOTES:
1. CIRCUITRY ON OUTER LAYERS TO BE PLATED WITH TIN LEAD
2. SOLDERMASK BOTH SIDES PER ARTWORK: GREEN LPI
3. SILKSCREEN BOTH SIDE PER ARTWORK: COLOR=WHITE
4
N
6434666A PWA, BENCH, EVALUATION BOARD, SN65LVDS100/101D, EVM 10/31/01
Summary of Contents for SLLU040A
Page 8: ...Contents viii ...
Page 12: ...1 4 ...
Page 20: ...2 8 ...
Page 26: ...Board Layer Patterns 3 6 Layer 3 VCC Split Plane INT2 Layer 4 GND Plane Bottom Side ...