Bill of Materials (Rev. C)
6-10
6.2
Bill of Materials (Rev. C)
Ref Des
Used Part Type
Footprint
Description
Population
Status
B1
1
SMT_BRIDGE
SAI_F27_1N
SHINDENGEN S1NB60
or Digikey
DF06SGICT-ND
C1 C100 C103 C104 C2
C20 C21 C23 C24 C3 C4
C5 C6 C76 C77 C78 C79
C80 C81 C82 C83 C84 C85
C86 C87 C88 C89 C90 C91
C92 C93 C94 C95 C96 C97
C98 C99
36
0.1
µ
F
0805
Ceramic multilayer
capacitor
C10 C11 C8 C9
4
220 pF 2KV
1808
NOVACAP
SP1808B221M202N
C12 C13 C15 C19 C22
C29 C30 C31 C32 C33 C34
C35 C36 C37 C38 C39 C40
C41 C42 C43 C44 C45 C46
C47 C48 C68 C69 C70
28
1
µ
F
1260
Ceramic multilayer
capacitor
C14 C18
2
560 pF
0805
Ceramic multilayer
capacitor
C16
1
4.7 nF
0805
Ceramic multilayer
capacitor
C17 C25 C49 C50 C51
C52 C53 C54 C56 C57
C58 C59 C60 C61 C62
C63 C64 C65 C66 C67
C71 C72 C73 C74 C75
25
10
µ
F
3528
C27
1
0.01
µ
F
0805
Ceramic multilayer
capacitor
C28
1
0.47
µ
F
0805
Ceramic multilayer
capacitor
C7
1
0.001
µ
F 500 V
1206
NOVACAP
1206B102K501N
D1
1
P3100SB
DO-214
TECCOR (Mouser
5191–P3100SA)
D2
1
LED red
1206
Digikey L62201CT-ND
D3
1
LED green
1206
Digikey L62205CT-ND
F1
1
FUSE
3216-CHIP
(1206)
WICKMANN 4431100000
1A 63 V Digikey
WK4661CT-ND
J1
1
RJ12
154–UL6663
Mouser RJ12 phone jack
–PN 154-UL6663
J10 J15
1
TFM-140
TFM-140
TFM-140-31-S-D
J15 TFM used
for mechanical
support
J12 J7 J8
3
PHONO_JACK
161-3504
PCB mount phone jack
Mouser 161-3504
J13 J14
2
12X3X.1
12X3X.1
36 pin header for PCB
interconnect
DO NOT
POPULATE
J2 J3 J4 J5 J6 J9
6
CON_2TERM_
SCREW
2term_screw_con
2-terminal screw
connector
Summary of Contents for TLV320AIC10 EVM
Page 1: ... January 2001 AAP Data Converters User s Guide SLWU003D ...
Page 4: ...iv ...
Page 12: ...1 6 ...
Page 34: ...5 6 ...
Page 38: ...Printed Circuit Board Rev C 6 4 Figure 6 3 Printed Circuit Board Layer 1 Rev C ...
Page 40: ...Printed Circuit Board Rev C 6 6 Figure 6 5 Printed Circuit Board Layer 3 Rev C ...
Page 42: ...Printed Circuit Board Rev C 6 8 Figure 6 7 Printed Circuit Board Layer 5 Rev C ...