TB9051FTG
Ver.1.1 2019-03-14
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8.1. Heat resistance characteristics
Figure 8.1 Heat resistance characteristics
◆
PCB A:
θ
ja=46.6°C/W,
θ
jc=1°C/W(Junction – E-Pad)
PCB size: 110 mm x 80 mm x 1.6 mm
Number of layers: Single Layer (Cu 1 layer)
Layer thickness of Cu: 70
μ
m
Layer area of Cu: 600mm
2
◆
PCB B:
θ
ja=26.4°C/W,
θ
jc=1°C/W(Junction – E-Pad)
PCB size: 114.3 mm x 76.2 mm x 1.6 mm (JDEC: Jesd51-7)
Number of layers: Multi Layer (Cu 4 layers)
Layer thickness of Cu: 35
μ
m (1/4 layers), 70
μ
m (2/3 layers)
Layer area of Cu: 74 x 74 mm
2
Condition: Power consumption 1W
Ambient (environment) temperature 25°C
Windless
0.1
1
10
100
0.001
0.01
0.1
1
10
100
1000
10000
A基板
B基板
Heat
resistance (
°
C/W)
Time (sec)
PCB A
PCB B
FR-4 layer
FR-4 layer
FR-4 layer
*According to Jesd51-7