User's Manual l MBa8MPxL UM 0100 l © 2022, TQ-Systems GmbH
Page 31
5.
MECHANICS
5.1
MBa8MPxL dimensions
The MBa8MPxL has overall dimensions (length × width) of 160 × 100 mm
2
.
The highest component on the top side of the MBa8MPxL is approximately 15.5 mm (stacked USB Type A connector).
The highest component on the bottom side of the MBa8MPxL is approximately 12 mm (pin header).
The overall height of the MBa8MPxL is approximately 29 mm.
The TQMa8MPxL assembled on the MBa8MPxL has a height of 3.18 mm ±0.23 mm above the MBa8MPxL.
The MBa8MPxL provides four 3.2 mm housing mounting holes, and four 2.7 mm heat sink mounting holes.
The MBa8MPxL including TQMa8MPxL weighs approximately 143 grams.
Figure 24: MBa8MPxL dimensions
5.2
Embedding in the overall system
The MBa8MPxL serves as a design base for customer products, as well as a platform to support during development.
5.3
Housing
The form factor and the mounting holes of the MBa8MPxL are designed for installation in a standard EURO housing.
5.4
Thermal management
The combination of MBa8MPxL and TQMa8MPxL has a power consumption of approximately 5 to 6 watts.
Further power consumption occurs mainly at externally connected devices.
Attention: TQMa8MPxL heat dissipation
The i.MX 8M Plus belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the TQMa8MPxL must be taken into consideration
when connecting the heat sink.
The TQMa8MPxL is not the highest component. Inadequate cooling connections can lead to
overheating of the TQMa8MPxL or the MBa8MPxL and thus malfunction, deterioration or destruction.
