User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH
Page 43
5.2
Notes of treatment
The TQMa8x is held in the mating connectors with a considerable retention force.
To avoid damaging the TQMa8x connectors as well as the carrier board connectors while removing the TQMa8x
the use of the extraction tool MOZIA8X is strongly recommended.
Note: Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the MBa8x
for the extraction tool MOZIA8X.
5.3
Embedding in the target system
The MBa8x serves as a design base for customer products, as well as a reference platform during development.
5.4
Thermal management
MBa8x plus TQMa8x have a maximum peak power consumption of approx. 206 W.
Further power loss occurs mainly at externally connected devices.
Attention: TQMa8x heat dissipation
The i.MX 8 CPU belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the TQMa8x must be taken into consideration when
connecting the heat sink.
The TQMa8x is not the highest component. Inadequate cooling connections can lead to overheating
of the TQMa8x or the MBa8x and thus malfunction, deterioration or destruction.
