User's Manual l MBa8x UM 0100 l © 2021, TQ-Systems GmbH
Page 48
9.
APPENDIX
9.1
Acronyms and definitions
The following acronyms and abbreviations are used in this document:
Table 33:
Acronyms
Acronym
Meaning
ADC
Analog/Digital Converter
ARM
®
Advanced RISC Machine
BIOS
Basic Input/Output System
BSP
Board Support Package
CAN
Controller Area Network
CPU
Central Processing Unit
CSI
Camera Serial Interface
DDR3L
Double Data Rate 3 Low voltage
DIN
Deutsche Industrienorm (German industry standard)
DIP
Dual In-line Package
DSI
Display Serial Interface
eCSPI
enhanced Capability Serial Peripheral Interface
eDP
Embedded Display Port
EEPROM
Electrically Erasable Programmable Read-Only Memory
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
eMMC
embedded Multimedia Card (Flash)
EN
Europäische Norm (European Standard)
ESD
Electrostatic Discharge
EuP
Energy using Products
FR-4
Flame Retardant 4
GP
General Purpose
GPIO
General Purpose Input/Output
I²C
Inter-Integrated Circuit
I²S
Inter-IC Sound
IEEE
®
Institute of Electrical and Electronics Engineers
IO
Input Output
IP00
Ingress Protection 00
JTAG
®
Joint Test Action Group
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LGA
Land Grid Array
LVDS
Low Voltage Differential Signal
MIPI
Mobile Industry Processor Interface
MOZI
Modulzieher (module extractor)
mPCIe
Mini Peripheral Component Interconnect Express
MTBF
Mean (operating) Time Between Failures
NAND
Not-And (flash memory)
NC
Not Connected
NOR
Not-Or
NP
Not Placed