User's Manual l MBa8Xx UM 0100 l © 2020, TQ-Systems GmbH
Page 50
Thermal management (continued)
Figure 27: TQMa8Xx heat sink mounting holes
Attention: TQMa8Xx heat dissipation
The i.MX 8X CPU belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Attention: Tolerance chain
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the TQMa8Xx must be taken into consideration when
connecting the heat sink.
The TQMa8Xx is not the highest component. Inadequate cooling connections can lead to overheating
of the TQMa8Xx or the MBa8Xx and thus malfunction, deterioration or destruction.
