Preliminary User's Manual l TQMa65xx UM 0001 l © 2021, TQ-Systems GmbH
Page 28
6.5
Climate and operational conditions
The operating temperature range for the TQMa65xx strongly depends on the installation situation (heat dissipation by heat
conduction and convection); hence, no fixed value can be given for the whole assembly.
In general, reliable operation is ensured if the following conditions are met:
Table 24:
Climate and operational conditions –25 °C to +85 °C
Parameter
Range
Remark
Ambient temperature
–25 °C to +85 °C
–
T
j
AM65xx
–40 °C to +105 °C
Junction temperature
T
j
PMIC
–40 °C to +125 °C
Junction temperature
Case temperature DDR4
–40 °C to +95 °C
–
Case temperature other ICs
–25 °C to +85 °C
–
Storage temperature TQMa65xx
–25 °C to +85 °C
–
Relative humidity (operating / storage)
10 % to 90 %
Not condensing
Table 25:
Climate and operational conditions –40 °C to +85 °C
Parameter
Range
Remark
Ambient temperature
–40 °C to +85 °C
–
T
j
AM65xx
–40 °C to +105 °C
Junction temperature
T
j
PMIC
–40 °C to +125 °C
Junction temperature
Case temperature DDR4
–40 °C to +95 °C
–
Case temperature other ICs
–40 °C to +85 °C
–
Storage temperature TQMa65xx
–40 °C to +85 °C
–
Relative humidity (operating / storage)
10 % to 90 %
Not condensing
For consumer applications, a version specified for a temperature range of 0 °C to +90 °C can be provided on request.
Detailed information concerning the thermal characteristics of the AM65xx is to be taken from the TI documents (1), and (2).
Attention: Destruction or malfunction, TQMa65xx heat dissipation
The TQMa65xx belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA
package, thermal pad, heatsink) as well as the maximum pressure on the AM65xx must be taken into
consideration when connecting the heat sink.
The AM65xx is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMa65xx and thus malfunction, deterioration or destruction.
6.6
Reliability and service life
The calculated MTBF of the TQMa65xx is 742,536 h @ +40 °C ambient temperature, Ground, Benign.
The TQMa65xx is designed to be insensitive to shock and vibration.
High quality industrial grade connectors are used on the TQMa65xx.
