AMY-5M
-
Hardware
Integration
Manual
Objective
Specification
Product
Handling
GPS.G5-MS5-08207
u-blox
proprietary
Page 36
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3.3.3 Reflow Soldering
A convection type-soldering oven is strongly recommended
over
the
infrared
type
radiation
oven.
Convection
heated
ovens
allow
precise
control
of
the
temperature
and
all
parts
will
be
heated
up
evenly,
regardless
of
material
properties,
thickness
of
components
and
surface
color.
Consider
the
"IPC-7530
Guidelines
for
temperature
profiling
for
mass
soldering
(reflow
and
wave)
processes,
published
2001".
Preheat Phase
Initial
heating
of
component
leads
and
balls.
Residual
humidity
will
be
dried
out.
Please
note
that
this
preheat
phase
will
not
replace
prior
baking
procedures.
•
Temperature
rise
rate:
1
-
4°C/s
If
the
temperature
rise
is
too
rapid
in
the
preheat
phase
it
may
cause
excessive
slumping.
•
Time:
60
–
120
seconds
If
the
preheat
is
insufficient,
rather
large
solder
balls
tend
to
be
generated.
Conversely,
if
performed
excessively,
fine
balls
and
large
balls
will
be
generated
in
clusters.
•
End
Temperature:
150
-
200°C
If
the
temperature
is
too
low,
non-melting
tends
to
be
caused
in
areas
containing
large
heat
capacity.
Heating/ Reflow Phase
The
temperature
rises
above
the
liquidus
temperature
of
216
-
221°C.
Avoid
a
sudden
rise
in
temperature
as
the
slump
of
the
paste
could
become
worse.
•
Limit
time
above
220°C
liquidus
temperature:
20
-
40s
•
Peak
reflow
temperature:
230
-
250°C
Cooling Phase
A
controlled
cooling
avoids
negative
metallurgical
effects
(solder
becomes
more
brittle)
of
the
solder
and
possible
mechanical
tensions
in
the
products.
Controlled
cooling
helps
to
achieve
bright
solder
fillets
with
a
good
shape
and
low
contact
angle.
•
Temperature
fall
rate:
max
3°C
/
s
To
avoid
falling
off,
the
u-blox
5
GPS
module
should
be
placed
on
the
topside
of
the
motherboard
during
soldering.
The
final
soldering
temperature
chosen
at
the
factory
depends
on
additional
external
factors
like
choice
of
soldering
paste,
size,
thickness
and
properties
of
the
base
board,
etc.
Exceeding
the
maximum
soldering
temperature
in
the
recommended
soldering
profile
may
permanently
damage
the
module.
