GPS
Modules
-
System
Integration
Manual
(SIM)
(incl.
Reference
Design)
Design-In
GPS.G4-MS4-05007-A1
Page 53
your position is our focus
3.6.2 Paste
Mask
Module
0.
8
m
m
[3
2
m
il]
a
a
Cu mask
Solder mask
Paste mask
minimal
distance
to
next
component
See
Enlargement
b
0.
8
m
m
[3
2
m
il]
d
a
Solder Paste
e
c
Cu P
a
d
0.
8m
m
[3
2
m
il]
Cu
Ma
sk
Module
0
.65m
m
[
2
6
m
il]
Cu M
a
sk
Cu
Ma
sk
b
0.1mm
[4mil]
0.
2
m
m
[7
8
m
il]
0.
1
5
m
m
[5
9
m
il]
Solder
Paste:
cross
section
ENLARGEMENT
Figure
41
and
Table
8
demonstrate
the
recommended
positioning
of
Cu,
Solder
and
Paste
Masks,
as
well
as
the
suggested
distances.
Note
that
these
are
recommendations
only
and
not
specifications.
The
exact
geometry,
distances
and
solder
paste
volumes
must
be
adapted
to
the
specific
production
processes
(e.g.
soldering
etc.)
of
e
mask
under
the
module
and
to
increase
the
amount
of
paste
mask
outside
the
module
by
using
a
step
stencil
and
exceeding
the
paste
mask
beyond
the
Cu
Mask
as
shown
in
Figure
41.
If
a
step
stencil
is
not
used
it
is
still
recommended
to
employ
the
same
volume
of
solder
paste
outside
the
module
to
attain
the
desired
level
of
wetting.
This
will
have
to
be
done
by
modifying
the
shape
of
the
paste
mask
outside
the
module.
Figure 41: Solder and paste mask with enlargement showing positioning and cross section of underlying solder paste
the
customer.
To
improve
the
wetting
of
the
half
vias
it
is
recommended
to
reduce
the
amount
of
past
Dimension
TIM-4x
LEA-4x
NEO-4S
a
1.8mm
[70mil]
1.8mm
[70mil]
1.7mm
[66mil]
b
1.0mm
[39mil]
1.0mm
[39mil]
0.9mm
[35mil]
c
0.65mm
[26mil]
0.65mm
[26mil]
0.65mm
[26mil]
d
0.9mm
[35mil]
0.8mm
[32mil]
0.8mm
[32mil]
e
1.3mm
[51mil]
1.5mm
[59mil]
1.5mm
[59mil]
Table 8: Paste Mask Dimensions for TIM-4x, LEA-4x and NEO-4S
Note
The
exact
geometry,
distances,
stencil
thicknesses,
step
heights
and
solder
paste
volumes
must
be
adapted
to
the
specific
production
processes
(e.g.
soldering
etc.)
of
the
customer.