your position is our focus
5.3.5 Cleaning
ly
discouraged.
Residuals,
which
are
underneath
the
®
bed
in
the
gap
between
the
baseboard
and
the
ANTARIS
®
4
GPS
Module.
The
combination
of
residuals
of
soldering
flux
and
encapsulated
water
s
ns
between
neighboring
pads.
Water
will
also
damage
the
sticker
and
the
ink-jet
printed
text.
ring
flux
residuals
into
the
two
accessible
for
post-washing
inspection.
The
solvent
will
also
damage
the
xt.
•
Ultrasonic
cleaning
will
damage
an
ANTARIS
®
4
GPS
Receiver
permanently,
in
particular
the
quartz
oscillators.
The
best
approach
is
to
consider
using
a
"no
clean"
soldering
paste
and
eliminate
the
cleaning
step
past
the
soldering.
5.3.6 Repeated
Reflow
Soldering
boards
with
an
ANTARIS
®
4
GPS
Module
populated
on
it.
Reason:
Risk
of
falling
off
due
to
high
weight
in
relation
to
the
adhesive
properties
of
the
solder.
5.3.7 Wave
Soldering
Bas
dev
enc
S
Module
populated
on
it.
out
s
IPC7711.
c
and
The
ANTARIS
®
4
GPS
Module
can
be
unsoldered
from
the
baseboard.
Use
desoldering
braid
made
of
copper.
Avoid
overheating
the
ANTARIS
®
4
GPS
Modules.
the
gap
below
the
module.
After
all
solder
has
been
removed
from
all
pads,
lift
the
component
carefully.
Continue
unsoldering
carefully
if
the
ANTARIS
®
4
GPS
Module
does
still
stick.
After
the
module
is
removed,
clean
the
pads
before
placing
and
hand-soldering
a
new
module.
!
Warning
Never
attempt
a
rework
on
the
module
itself,
e.g.
replacing
individual
components.
Such
actions
will
terminate
warranty
coverage
immediately.
In
general,
cleaning
the
populated
modules
is
strong
ANTARIS 4
GPS
Modules,
cannot
be
removed
easily
with
a
washing
process.
•
Cleaning
with
water
will
lead
to
capillary
effects
where
water
is
absor
lead
to
short
circuits
or
resistor-like
interconnectio
•
Cleaning
with
alcohol
or
a
similar
organic
solvent
will
likely
flood
solde
housings,
which
is
a
place
not
sticker
and
the
ink-jet
printed
te
Only
a
single
reflow
soldering
process
is
encouraged
for
e
boards
with
combined
through-hole
technology
(THT)
components
and
surface-mount
technology
(SMT)
ices
require
a
wave
soldering
to
solder
the
THT
components.
Only
a
single
wave
soldering
process
is
ouraged
for
boards
with
an
ANTARIS
®
4
GP
5.3.8 Hand
Soldering
Hand
soldering
is
allowed.
Use
a
Soldering
iron
temperature
setting
"7"
which
is
equivalent
to
350°C
and
carry
the
hand
soldering
according
to
the
IPC
recommendations
/
reference
document
Pla e
the
ANTARIS
®
4
GPS
Module
precisely
on
the
pads.
Start
with
a
cross-diagonal
fixture
soldering
(e.g.
pins
1
16),
and
then
continue
from
left
to
right.
5.3.9 Rework
A
vacuum
solder
sucker
is
not
recommended
as
solder
residuals
may
remain
in
GPS
Modules
-
System
Integration
Manual
(SIM)
(incl.
Reference
Design)
Product
Handling
GPS.G4-MS4-05007-A1
Page 131
