LARA-R2 series - System Integration Manual
UBX-16010573 - R02
Objective Specification
Handling and soldering
Page 126 of 148
3
Handling and soldering
No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.
3.1
Packaging, shipping, storage and moisture preconditioning
For information pertaining to LARA-R2 series reels / tapes, Moisture Sensitivity levels (MSD), shipment and
storage information, as well as drying for preconditioning, see the
LARA-R2 series
Data Sheet
[1] and the
u-blox
Package Information Guide
3.2
Handling
The LARA-R2 series modules are Electro-Static Discharge (ESD) sensitive devices.
Ensure ESD precautions are implemented during handling of the module.
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two objects at
different electrical potentials caused by direct contact or induced by an electrostatic field. The term is usually
used in the electronics and other industries to describe momentary unwanted currents that may cause damage
to electronic equipment.
The ESD sensitivity for each pin of LARA-R2 series modules (as Human Body Model according to JESD22-A114F)
is specified in the
LARA-R2 series
Data Sheet
ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small working
station or a large manufacturing area. The main principle of an EPA is that there are no highly charging materials
near ESD sensitive electronics, all conductive materials are grounded, workers are grounded, and charge build-up
on ESD sensitive electronics is prevented. International standards are used to define typical EPA and can be
obtained for example from International Electrotechnical Commission (IEC) or American National Standards
Institute (ANSI).
In addition to standard ESD safety practices, the following measures should be taken into account whenever
handling the LARA-R2 series modules:
Unless there is a galvanic coupling between the local GND (i.e. the work table) and the PCB GND, then the
first point of contact when handling the PCB must always be between the local GND and PCB GND.
Before mounting an antenna patch, connect ground of the device.
When handling the module, do not come into contact with any charged capacitors and be careful when
contacting materials that can develop charges (e.g. patch antenna, coax cable, soldering iron,…).
To prevent electrostatic discharge through the RF pin, do not touch any exposed antenna area. If there is any
risk that such exposed antenna area is touched in non ESD protected work area, implement proper ESD
protection measures in the design.
When soldering the module and patch antennas to the RF pin, make sure to use an ESD safe soldering iron.
For more robust designs, employ additional ESD protection measures on the application device integrating the
LARA-R2 series modules, as described in section 2.13.3.
