LEON-G100 / LEON-G200 - System Integration Manual
GSM.G1-HW-09002-G3
Preliminary
Design-In
Page 92 of 125
Figure 50: Signals keep-out below data module on application motherboard due to GND opening on data module bottom layer
for internal RF signals
Routing below LEON-G100 / LEON-G200 on application motherboard is generally possible but not
recommended: in addition to the required keep-out defined before, consider that the insulation offered by the
solder mask painting may be weakened corresponding to micro-vias on LEON-G100 / LEON-G200 bottom layer,
thus increasing the risk of short to GND if the application motherboard has unprotected signal routing on same
coordinates.
2.2.3
Placement
Optimize placement for minimum length of RF line and closer path from DC source for
VCC
.
2.3
Module thermal resistance
The Case-to-Ambient thermal resistance (R
C-A
) of the module, with the LEON-G100 / LEON-G200 mounted on a
130 x 110 x 1.6 mm FR4 PCB with a high coverage of copper (e.g. the EVK-G25H evaluation kit) in still air
conditions is equal to 14°C/W.
With this Case-to-Ambient thermal resistance, the increase of the module temperature is:
Around 12°C when the module transmits at the maximum power level during a GSM call in the GSM/EGSM
bands
Around 17°C when the module transmits at the maximum power level during a GPRS data transfer (2 Tx +
3 Rx slots) in the GSM/EGSM bands
