LILY-W1 series - System integration manual
UBX-15027600 - R09
Handling and soldering
Page 44 of 64
C1 - Public
The module is compatible with industrial reflow profile for RoHS solders. Use of "No Clean" soldering
paste is strongly recommended.
The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer
efficiency of the oven and particular type of solder paste used. The optimal soldering profile used is
dependent on specific process and PCB layout thus has to be trimmed for each case.
Process parameter
Unit
Target
Pre-heat
Ramp up rate to
T
SMIN
K/s
3
T
SMIN
°C
150
T
SMAX
°C
200
t
S
(from 25°C)
s
150
t
S
(Pre-heat)
s
110
Peak
T
L
°C
217
t
L
(time above
T
L
)
s
90
T
P
(absolute max)
°C
260
t
P
(time above
T
P
-5°C)
s
40
Cooling
Ramp-down from
T
L
K/s
6
General
T
to peak
s
300
Allowed soldering cycles
-
1
Table 24: Recommended reflow profile
Figure 12: Reflow profile
☞
Lower value of T
P
and slower ramp down rate (2 – 3 °C/sec) is preferred.
☞
After reflow soldering, optical inspection of the modules is recommended to verify proper
alignment.
⚠
Target values in Table 24 should be taken as general guidelines for a Pb-free process, refer to the
JEDEC J-STD-020C [10] standard for further information.
4.3.1
Cleaning
Cleaning the modules is not recommended. Residues underneath the modules cannot be easily
removed with a washing process.