NEO-5
-
Hardware
Integration
Manual
Preliminary
Product
Handling
GPS.G5-MS5-08003-A2
u-blox
proprietary
Page 32
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Preheat
0
50
100
150
200
250
300
50
100
150
200
250
Heating
Cooling
50
100
150
200
250
max 1- 4 °C/s
max 60 - 120 s
Peak Temp.
230 - 250 °C
Liquidus Temperature
116 - 221
[°C]
Elapsed Time [s]
max 20 - 40 s
Typical Leadfree
Soldering Profile
End Temp.
150 - 200 °C
max 3 °C/s
[°C]
Figure 20: Recommended soldering profile
When
soldering
leadfree
(u-blox
5)
modules
in
a
leaded
process,
check
the
following
temperatures:
o
PB-
Technology
Soaktime:
40-80sec
o
Time
above
Liquidus:
40-90
sec
o
Peak
temperature:
225-235
°C
NEO-5
modules
must
not
be
soldered
with
a
damp
heat
process.
3.3.4 Optical
Inspection
After
soldering
the
NEO-5
module,
consider
an
optical
inspection
step
to
check
whether:
•
The
module
is
properly
aligned
and
centered
over
the
pads
•
All
pads
are
properly
soldered
•
No
excess
solder
has
created
contacts
to
neighboring
pads,
or
possibly
to
pad
stacks
and
vias
nearby.