NORA-W10 series - System integration manual
UBX-22005601 - R04
Handling and soldering
Page 35 of 56
C1-Public
5.3.1
Cleaning
Cleaning the modules is not recommended. Residues underneath the modules cannot be easily
removed with a washing process.
•
Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water
leads to short circuits or resistor-like interconnections between neighboring pads. Water will also
damage the sticker and the ink-jet printed text.
•
Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into
the two housings areas that are not accessible for post-wash inspections. The solvent will also
damage the sticker and the ink-jet printed text.
•
Ultrasonic cleaning will permanently damage the module and crystal oscillators in particular.
For best results use a "no clean" soldering paste and circumvent the need for a cleaning stage after
the soldering process.
5.3.2
Other remarks
•
Two reflow soldering processes are allowed for boards with a module soldered on it.
•
Boards with combined through-hole technology (THT) components and surface-mount technology
(SMT) devices may require wave soldering to solder the THT components. Only a single, wave-
soldering process is allowed for boards populated with the modules. Miniature Wave Selective
Solder processes are preferred over traditional wave soldering processes.
•
Hand soldering is not recommended.
•
Rework is not recommended.
•
Conformal coating may affect the performance of the module, it is important to prevent the liquid
from flowing into the module. The RF shields do not provide protection for the module from coating
liquids with low viscosity; therefore, care is required when applying the coating. Conformal coating
of the module will void the warranty.
•
Grounding metal covers: Attempts to improve grounding by soldering ground cables, wick, or other
forms of metal strips directly onto the EMI covers is done at the customer's own risk and will void
the module warranty. The numerous ground pins on the module are adequate to provide optimal
immunity to interferences.
•
The modules contain components that are sensitive to Ultrasonic Waves. Use of any ultrasonic
processes, such as cleaning, welding, etc., may damage the module. The use of ultrasonic
processes during the integration of the module into an end product will void the warranty.
