NORA-W30 series - System integration manual
UBX-22021119 - R02
Handling and soldering
Page 33 of 52
C1-Public
5.3
Reflow soldering process
NORA-W30 series modules are surface mounted devices supplied in a Land Grid Array (LGA) package
with gold-plated solder lands. The modules are manufactured in a lead-free process with lead-free
soldering paste.
The thickness of solder resist between the host PCB top side and the bottom side of the NORA-W30
series module must be considered for the soldering process.
NORA-W30 modules are compatible with the industrial reflow profile for common SAC type RoHS
solders. No-clean soldering paste is strongly recommended. The reflow profile is dependent on the
thermal mass over the entire area of the fully populated host PCB, the heat transfer efficiency of the
oven, and the type of solder paste that is used. The optimal soldering profile that is used must be
trimmed for each case depending on the specific soldering process and PCB layout.
⚠
The target parameter values shown in
are only general guidelines for a Pb-free process.
The given values are tentative and subject to change. For further information, see also the JEDEC
J-STD-020C standard
Process parameter
Unit
Target
Pre-heat
Ramp up rate to T
SMIN
K/s
3
T
SMIN
°C
150
T
SMAX
°C
200
t
S
(from +25 °C)
s
150
t
S
(Pre-heat)
s
60 to 120
Peak
T
L
°C
217
t
L
(time above T
L
)
s
40 to 60
T
P
(absolute max)
°C
245
Cooling
Ramp-down from T
L
K/s
4
Allowed soldering cycles
-
1
Table 11: Recommended reflow profile
Figure 8: Reflow profile
☞
Lower value of T
P
and slower ramp down rate (2
–
3 °C/sec) is preferred.
