SARA-G3 series - System Integration Manual
UBX-13000995 - R06
Objective Specification
Design-in
Page 153 of 218
2.10
Module footprint and paste mask
describe the suggested footprint (i.e. copper mask) and paste
mask layout for SARA-G3 modules: the proposed land pattern layout reflects the modules’ pads layout,
while the proposed stencil apertures layout is slightly different (see the F’’, H’’, I’’, J’’, O’’ parameters
compared to the F’, H’, I’, J’, O’ ones).
The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD)
pad type, implementing the solder mask opening 50 µm larger per side than the corresponding copper
pad.
The recommended solder paste thickness is 150 µm, according to application production process
requirements.
K
M1
M1
M2
E
G
H’
J’
E
ANT pin
B
Pin 1
K
G
H’
J’
A
D
D
O’
O’
L
N
L
I’
F’
F’
K
M1
M1
M2
E
G
H’’
J’’
E
ANT pin
B
Pin 1
K
G
H’’
J’’
A
D
D
O’’
O’’
L
N
L
I’’
F’’
F’’
Stencil: 150
µm
Figure 63: SARA-G3 series modules suggested footprint and paste mask (application board top view)
Parameter
Value
Parameter
Value
Parameter
Value
A
26.0 mm
G
1.10 mm
K
2.75 mm
B
16.0 mm
H’
0.80 mm
L
2.75 mm
C
3.00 mm
H’’
0.75 mm
M1
1.80 mm
D
2.00 mm
I’
1.50 mm
M2
3.60 mm
E
2.50 mm
I’’
1.55 mm
N
2.10 mm
F’
1.05 mm
J’
0.30 mm
O’
1.10 mm
F’’
1.00 mm
J’’
0.35 mm
O’’
1.05 mm
Table 37: SARA-G3 series modules suggested footprint and paste mask dimensions
