SARA-G3 series - System Integration Manual
UBX-13000995 - R06
Objective Specification
Handling and soldering
Page 172 of 218
3
Handling and soldering
No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.
3.1
Packaging, shipping, storage and moisture preconditioning
For information pertaining to reels and tapes, Moisture Sensitivity levels (MSD), shipment and storage
information, as well as drying for preconditioning see the
SARA-G3 series Data Sheet [1] and the u-blox
Package Information Guide [24].
The SARA-G3 series modules are Electro-Static Discharge (ESD) sensitive devices.
Ensure ESD precautions are implemented during handling of the module.
3.2
Soldering
3.2.1
Soldering paste
Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning after the
soldering process has taken place. The paste listed in the example below meets these criteria.
Soldering Paste:
OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification:
95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9% Silver / 0.6% Copper)
95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper)
Melting Temperature: 217 °C
Stencil Thickness:
150 µm for base boards
The final choice of the soldering paste depends on the approved manufacturing procedures.
The paste-mask geometry for applying soldering paste should meet the recommendations in section 2.10
The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC
specification.
3.2.2
Reflow soldering
A convection type-soldering oven is strongly recommended
over the infrared type radiation oven. Convection
heated ovens allow precise control of the temperature and all parts will be heated up evenly, regardless of
material properties, thickness of components and surface color.
Consider the "IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave)
processes, published 2001".
Reflow profiles are to be selected according to the following recommendations.
Failure to observe these recommendations can result in severe damage to the device!
