SARA-G3 series - System Integration Manual
UBX-13000995 - R06
Objective Specification
Handling and soldering
Page 177 of 218
3.2.10
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to
qualify such processes in combination with the SARA-G3 series modules before implementing this in the
production.
Casting will void the warranty.
3.2.11
Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto
the EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to
provide optimum immunity to interferences and noise.
u-blox gives no warranty for damages to the SARA-G3 series modules caused by soldering metal
cables or any other forms of metal strips directly onto the EMI covers.
3.2.12
Use of ultrasonic processes
SARA-G3 series modules contain components which are sensitive to Ultrasonic Waves. Use of any
Ultrasonic Processes (cleaning, welding etc.) may cause damage to the module.
u-blox gives no warranty against damages to the SARA-G3 series modules caused by any
Ultrasonic Processes.
