SARA-G3 series - System Integration Manual
UBX-13000995 - R06
Objective Specification
Product Testing
Page 188 of 218
Example of production tests for OEM manufacturer:
1.
Trigger TX GMSK burst at low Power Control Level (lower than 15) or a RX measure reporting to
check:
o
If
ANT
pin is soldered
o
If
ANT
pin is in short circuit
o
If the module was damaged during soldering process or during handling (ESD, mechanical
shock…)
o
If antenna matching components on application board are soldered
o
If integrated antenna is correctly connected
To avoid module damage during transmitter test when good antenna termination is not guaranteed, use a
low Power Control Level (i.e. PCL lower or equal to 15). u-blox assumes no responsibilities for module
damaging caused by an inappropriate use of this feature.
2.
Trigger TX GMSK burst at maximum PCL:
o
To check if the power supply is correctly assembled and is able to deliver the required
current
3.
Trigger TX GMSK burst:
o
To measure current consumption
o
To check if module components were damaged during soldering process or during handling
(ESD, mechanical shock…)
4.
Trigger RX measurement:
o
To test receiver signal level. Assuming that there are no losses between
ANT
pin and input
power source, be aware that the power level estimated by the module can vary approximately
within 3GPP tolerances for the average value
o
To check if module was damaged during soldering process or during handling (ESD,
mechanical shock…)
5.
Trigger TX GMSK burst and RX measurement to check:
o
Overall RF performance of the device including antenna measuring TX and RX power levels
