LENA-R8 series - System integration manual
UBX-22015376 - R02
Handling and soldering
Page 101 of 116
C1-Public
3.3.5
Repeated reflow soldering
Repeated reflow soldering processes and soldering the module upside-down are not recommended.
Boards with components on both sides may require two reflow cycles. In this case, the module should
always be placed on the side of the board that is submitted into the last reflow cycle. The reason for
this (besides others) is the risk of the module falling off due to the significantly higher weight in
relation to other components.
☞
u-blox gives no warranty against damages to the LENA-R8 series modules caused by performing
more than a total of two reflow soldering processes (one reflow soldering process to mount the
LENA-R8 series module, plus one reflow soldering process to mount other parts).
3.3.6
Wave soldering
LENA-R8 series LGA modules must not be soldered with a wave soldering process.
Boards with combined through-hole technology (THT) components and surface-mount technology
(SMT) devices require wave soldering to solder the THT components. No more than one wave
soldering process is allowed for a board with a LENA-R8 series module already populated on it.
⚠
Performing a wave soldering process on the module can result in severe damage to the device!
☞
u-blox gives no warranty against damages to the LENA-R8 series modules caused by performing
more than a total of two reflow soldering processes (one reflow soldering process to mount the
LENA-R8 series module, plus one plus one wave soldering process to mount other THT parts on
the application board).
3.3.7
Hand soldering
Hand soldering is not recommended.
3.3.8
Rework
Rework is not recommended.
☞
Never attempt a rework on the module itself, e.g. replacing individual components. Such actions
immediately terminate the warranty.
3.3.9
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal
®
or other related coating
products. These materials affect the RF properties of the LENA-R8 series modules and it is important
to prevent them from flowing into the module. The RF shields do not provide 100% protection for the
module from coating liquids with low viscosity, and therefore care is required in applying the coating.
☞
Conformal coating of the module will void the warranty.
3.3.10
Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to
qualify such processes in combination with the LENA-R8 series modules before implementing this in
production.
☞
Casting will void the warranty.
