4.5.2 EOS precautions...........................................................................................................................31
4.5.3 Safety precautions...................................................................................................................... 32
4.6.1 General notes on interference issues...................................................................................... 32
4.6.2 In-band interference mitigation................................................................................................33
4.6.3 Out-of-band interference........................................................................................................... 33
4.7.1 Placement...................................................................................................................................... 34
4.7.2 Thermal management................................................................................................................ 34
4.7.3 Package footprint, copper and paste mask........................................................................... 34
4.7.4 Layout guidance........................................................................................................................... 36
4.8.1 General considerations............................................................................................................... 38
4.8.2 RF front-end circuit options...................................................................................................... 38
4.8.3 Antenna/RF input........................................................................................................................ 39
4.8.4 Schematic design........................................................................................................................ 39
4.8.5 Layout design-in guideline......................................................................................................... 40
5.1 ESD handling precautions.................................................................................................................. 41
5.2 Soldering................................................................................................................................................. 41
5.3 Tapes....................................................................................................................................................... 44
5.4 Reels........................................................................................................................................................ 45
5.5 Moisture sensitivity levels.................................................................................................................. 45
A Stacked patch antenna.......................................................................................................................... 47
B Glossary......................................................................................................................................................48
Related documents................................................................................................................ 50
Revision history....................................................................................................................... 51