NEO-D9S - Integration manual
As a reference, see “IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and
wave) processes”, published in 2001.
Preheat phase
During the initial heating of component leads and balls, residual humidity will be dried out. Note that
the preheat phase does not replace prior baking procedures.
• Temperature rise rate: max 3 °C/s. If the temperature rise is too rapid in the preheat phase,
excessive slumping may be caused
• Time: 60 – 120 s. If the preheat is insufficient, rather large solder balls tend to be generated.
Conversely, if performed excessively, fine balls and large balls will be generated in clusters
• End temperature: 150 – 200 °C. If the temperature is too low, non-melting tends to be caused in
areas containing large heat capacity
Heating - reflow phase
The temperature rises above the liquidus temperature of 217 °C. Avoid a sudden rise in temperature
as the slump of the paste could become worse.
• Limit time above 217 °C liquidus temperature: 40 – 60 s
• Peak reflow temperature: 245 °C
Cooling phase
A controlled cooling prevents negative metallurgical effects of the solder (solder becomes more
brittle) and possible mechanical tensions in the products. Controlled cooling helps to achieve bright
solder fillets with a good shape and low contact angle.
• Temperature fall rate: max 4 °C/s
To avoid falling off, the modules should be placed on the topside of the motherboard during
soldering.
The final soldering temperature chosen at the factory depends on additional external factors such
as the choice of soldering paste, size, thickness and properties of the base board, etc. Exceeding the
maximum soldering temperature in the recommended soldering profile may permanently damage
the module.
Figure 30: Soldering profile
UBX-19026111 - R07
5 Product handling
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