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tezo™
Assembly and disassembly instructions
This document lists all assembly and disassembly instructions available for the system tezo™. The instruments must
be disassembled according to the manufacturer’s instructions to ensure the processing and storage.
The product descriptions in the component overview and in the descriptive text are listed in English according to the
inscription on the instruments.
The user has to ensure that the latest versions of the system-related surgical technique and the "Processing
manual implants and instruments" UH 1100 are on hand and considered. These are also available at:
.
Notes regarding assembly and disassembly
instructions
