UM621N User Manual
UC-00-M51 EN R1.0
Clean
13
5
Clean
DO NOT use alcohol or other organic solvents to clean, which may lead to soldering
flux residues flooding into the shielding shell, causing mildew and other problems.
6
Reflow Soldering
In order to avoid the device falling off, the module should be placed on the top of the
main board during soldering. Reflow soldering temperature curve is recommended as
shown in figure 6-1 below (M705-GRN360 is recommended for solder paste).
Note: The module can only be soldered once.
Figure 6-1 Reflow Soldering Temperature Curve
Note: The apertures in the stencil need to meet the customer's own design
requirements and inspection specifications, and the thickness of the stencil should be
above 0.15 mm. It is recommended to be 0.18 mm.
