78
D292469I
NOTE:
Any contamination on the pickup surface (such as finger grease), or on
the wafer (such as photo-resist material) will impair die release reliability.
There is a trade-off between Purge Time and Purge Pressure. You will need a shorter
time using a higher pressure. When using high blow off pressure, it is important to
adjust the placement height so that the die is not blown out of the cavity. See
ADJUSTING THE PLACEMENT HEIGHT section above.
Summary of Contents for Royce DE35-ST
Page 2: ...2 D292469I BLANK PAGE...
Page 26: ...DE35 ST Operating Instructions D292469I 25 BLANK PAGE...
Page 45: ...44 D292469I BLANK PAGE...
Page 57: ...56 D292469I BLANK PAGE...
Page 83: ...82 D292469I NOTE The Die Ejector is automatically switched off after about 1 minute...
Page 95: ...94 D292469I Blank Page...
Page 107: ...106 D292469I Blank Page...
Page 130: ...DE35 ST Operating Instructions D292469I 129 Blank Page...
Page 132: ...DE35 ST Operating Instructions D292469I 131 Blank Page...
Page 134: ...DE35 ST Operating Instructions D292469I 133 Blank Page...