DE35-ST Operating Instructions
D292469I
89
Non-Surface Contact Operation
Non-Surface Contact (NSC) is a method of picking up the die which prevents any physical
contact with the top surface of the die. To perform NSC die pick up from adhesive tape,
the die must first be ejected from the tape. Once ejected, the die is picked up by the
edges.
In order for the die to be picked up by its edges, it must first be elevated from the wafer
yet remain in position on top of the needles. This allows the Gripper Fingers to make
reliable contact with the edges of the die.
During NSC operation, a blunt Stabilizing Pin is used in the center of the conventional
four Eject Needle array. Its purpose is to prevent the tape from completely releasing
from the back of the die. If the tape is permitted to release completely, at the final
moment of release the tape tends to snap away from the back of the die. This causes
the die to jump unpredictably. The Stabilizing Pin maintains a very small area of
adhesive contact and prevents the full release of the die from the tape. The remaining
adhesive force is usually under 1 or 2 grams and is easily overcome when the die is
lifted.
Non-Surface Contact Pickup Cycle
The following is a breakdown of the Non-Surface Contact pick and place cycle. You can
view each of these steps by pressing the
SINGLE STEP
key and stepping through the
cycle.
1.
TURN ON TAPE VACUUM
Vacuum is applied through the Eject Head to hold the tape in place. No
adjustments are necessary.
2.
ARM GO TO PICK POSITION
The Pickup Arm will move to position the Pickup Tip directly above the center of
the next die to be picked. The
Left/Right Arrow
keys can be used to move the
Pickup Tip as necessary.
3.
GO DOWN TO PICK HEIGHT
The Pickup Head will lower to the position at which it will pick the die. This
position should be set so when the needles rise the die will move up between
the Gripper Fingers. This height can be adjusted using the
UP/DOWN
keys along
with the
COARSE/FINE
key.
Summary of Contents for Royce DE35-ST
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