Last update: 2014/07/30 18:37
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Printed on 2019/05/01 00:16
Fig. 2: Communication system block diagram.
Considerations for integrating the ICE Platform stack in an OEM situation are detailed in the remainder
of this document. Important key points include deciding on the type and quantity of daughter
modules to use and how that relates to the overall power budget for both the power supply and the
maximum currents that can be routed through the power bus. The mechanics of mounting the circuit
boards and designing a thermal management system must also be designed. Connections for
communication and I/O from the circuit boards to the integrator's system are also detailed in the
document.
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Power Requirements
Power Entry
Power needs to be supplied to the power bus headers on all ICE circuit boards. These headers and
respective supply voltages are shown in
. The ICE master controller board (
) takes a
single power entry point and distributes power to these headers. The master controller board also
provides fault protection, power sequencing, in-rush current protection, and over-current protection in
addition to distributing power. It is highly recommended to only power the ICE board stack through an
ICE master controller for these functions. If power is applied by the OEM integrator directly to the ICE
power bus, the ICE power sequencing and protection requirements in this document must be strictly
followed to avoid damaging connected ICE modules.
