WAGO-I/O-SYSTEM 750
Assembly
65
750-880, 750-880/025-000 ETHERNET Programmable Fieldbus Controller
Manual
Version 1.0.1
Pos: 61.4 /Serie 750 (WAGO-I/O-SYSTEM)/Montieren/Montage auf Tragschiene @ 3\mod_1225447227234_21.doc @ 24906 @ 233 @ 1
5.3
Assembly onto Carrier Rail
5.3.1
Carrier Rail Properties
All system components can be snapped directly onto a carrier rail in accordance
with the European standard EN 50022 (DIN 35).
NOTICE
Do not use any third-party carrier rails without approval by WAGO!
WAGO Kontakttechnik GmbH & Co. KG supplies standardized carrier rails that
are optimal for use with the I/O system. If other carrier rails are used, then a
technical inspection and approval of the rail by WAGO Kontakttechnik GmbH &
Co. KG should take place.
Carrier rails have different mechanical and electrical properties. For the optimal
system setup on a carrier rail, certain guidelines must be observed:
•
The material must be non-corrosive.
•
Most components have a contact to the carrier rail to ground electro-
magnetic disturbances. In order to avoid corrosion, this tin-plated carrier rail
contact must not form a galvanic cell with the material of the carrier rail
which generates a differential voltage above 0.5 V (saline solution of 0.3 %
at 20°C).
•
The carrier rail must optimally support the EMC measures integrated into
the system and the shielding of the bus module connections.
•
A sufficiently stable carrier rail should be selected and, if necessary, several
mounting points (every 20 cm) should be used in order to prevent bending
and twisting (torsion).
•
The geometry of the carrier rail must not be altered in order to secure the
safe hold of the components. In particular, when shortening or mounting the
carrier rail, it must not be crushed or bent.
•
The base of the I/O components extends into the profile of the carrier rail.
For carrier rails with a height of 7.5 mm, mounting points are to be riveted
under the node in the carrier rail (slotted head captive screws or blind
rivets).
•
The medal springs on the bottom of the housing must have low-impedance
contact with the DIN rail (wide contact surface is possible).