Ink Removal Information
Ink
820-0332
5-4
Ink Removal Information
A rinse with isopropyl alcohol or acetone generally removes ink completely if the wafer is
washed shortly after inking (within 5 minutes). An ultrasonic bath is recommended to
ensure complete removal of ink residue. Ink dots, which have been air dried or hard cured,
require the application of an ink remover.
DieMark Remover 8000
Xandex has developed DieMark Remover 8000 specifically for the semi-conductor
industry. DieMark Remover 8000 thoroughly removes all inks supplied by Xandex,
including oven baked ink dots. DieMark Remover 8000 has very low levels of organic and
inorganic contaminants and is an efficient and thorough ink remover when used in simple
bench top cleaning methods. Due to its high flash point, DieMark Remover 8000 is also
safe and effective when used in ultrasonic, temperature/pressure cycling under vacuum and
deep bath heating and agitation ink removal processes.
DieMark Remover 8000 is carcinogen free (NTP, OSHA) and all ingredients used are
TSCA listed. For an MSDS or more information on using DieMark Remover 8000 in your
specific ink removal process, contact Xandex Customer Service.
Ink Removal Procedure
The following is the recommended bench top procedure for removing ink from wafers
using DieMark Remover 8000. *
All procedures should be performed under a laboratory
hood, following proper safety precautions (protective
goggles, gloves and clothing).
1.
Apply sparingly with an eyedropper to a localized area of the wafer.
2.
Allow 2-3 minutes for the DieMark Remover 8000 to begin solvating. Time
required will vary depending on the degree that the ink was cured.
3.
For highly cured ink dots, use longer soak times, then wipe gently with a clean
lint-free cloth to facilitate removal. If necessary, repeat steps 1 and 2.
4.
For large areas or removal of ink from entire wafer, soak a clean lint-free cloth
with DieMark Remover 8000, then lay the wet cloth over the entire surface and
allow time to soak/solvate ink, then remove wet cloth. Repeat as necessary.
5.
After dots are removed, clean wafer via standard procedures, such as vapor
degreasing, and/or rinse with a clean solvent (Isopropyl Alcohol) followed by
a bake cycle at 65
°
C to dry.
CAUTION
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