SERVICE MANUAL
HAMAMATSU, JAPAN
1.51K-166
Printed in Japan 2000.02
PA
011494
CONTENTS
SPECIFICATIONS ................................................................................ 3
PANEL LAYOUT .................................................................................. 7
CIRCUIT BOARD LAYOUT ................................................................. 10
DIMENSIONS .................................................................................... 10
BLOCK & LEVEL DIAGRAM .............................................................. 11
DISASSEMBLY PROCEDURE .......................................................... 12
LSI PIN DISCRIPTION ........................................................................ 14
IC BLOCK DIAGRAM ......................................................................... 15
INSPECTION...................................................................................... 16
PARTS LIST
CIRCUIT DIAGRAM
CIRCUIT BOARDS
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