SERVICE MANUAL
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CONTENTS
SPECIFICATIONS .............................................................................. 3
PANEL LAYOUT ................................................................................. 4
BLOCK DIAGRAM ............................................................................. 5
CIRCUIT BOARD LAYOUT & WIRING .............................................. 6
DISASSEMBLY PROCEDURE .......................................................... 7
LSI PIN DESCRIPTION ................................................................... 10
IC BLOCK DIAGRAM ....................................................................... 11
CIRCUIT BOARDS .......................................................................... 12
TEST PROGRAM ............................................................................ 15
MIDI IMPLEMENTATION CHART .................................................... 17
This document is printed on chlorine free (ECF) paper with soy ink.
1.412K-355
Printed in Japan ’01.05
PK
001652