CLM920_RC3(RV3 RE3)LCC Series CAT1 Module Hardware Manual
Shanghai YUGE Information Technology Co., Ltd.
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on the second side. To avoid module drop-outs, solder opening and poor soldering inside
the module due to gravity caused by the module.
The recommended furnace temperature curve is shown below
:
Figure 7-1 Reflow soldering temperature curve
Table 7-1 Reflow process parameter table
Temperature zone
Time
key parameter
Preheat zone(40
℃~
165
℃
)
Heating rate: 1
℃
/s
~
3
℃
/s
Temperature
zone(160
℃~
210
℃
)
(t1
~
t2)
:
70s
~
120s
Reflow zone(>217
℃
)
(t3
~
t4)
:
40s
~
60s
Peak temperature: 235
℃ ~
245
℃
Cooling zone
Cooling rate: 2
℃
/s
≤
Slope
≤
5
℃
/s