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System expansions and repairs document
Information on the installation and removal of components
Removing the memories under the service door
Inserting the memories under the service door
Removing the M.2 module under the service door
Inserting the M.2 module under the service door
Mandatory Support Bulletins for Disassembly
Removing the memories under the keyboard
Removing the M.2 module under the keyboard
Removing the SmartCard sub board
Removing the TPM module (Nation Z)
Removing the touchpad buttons sub board
Removing the palm vein/fingerprint sensor sub board
Removing the USB / audio sub board
Removing the LCD front cover assy
Disposal information for recycling companies
System expansions and repairs document
CELSIUS H7510
Version date
20.11.2020
Category
System expansions and repairs document
Summary of Contents for CELSIUS H7510
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