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MF877-00                                                                                                Page  1 
Template Revision C, 30-July-2018 

 

Copyright 2018 Hewlett Packard Enterprise Development LP

 

HPE instructions for this template are available a

MF877-01

  

 

Product End-of-Life Disassembly Instructions 

Product Category

Storage

 

 

Marketing Name / Model 

 

[List multiple models if applicable.] 

HPE Cray Cls 4U 106-18TB SAS Drive Encl 

HPE Cray Cls 4U 106-10TB SAS Drive Encl 

HPE Cray Cls 4U 106-12TB SAS Drive Encl 

HPE Cray Cls 4U 106-14TB SAS Drive Encl 

HPE Cray Cls 4U 106-16TB SAS Drive Encl 

HPE Cray CS E1000 20TB 4U106 FIO HDD Encl 

HPE Cray Cls 4U 106-24TB SAS Drive Encl 

HPE Cray CS E1000 10TB 4U106 SED HDD Encl 

HPE Cray CS E1000 16TB 4U106 SED HDD Encl 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic 

instructions for the disassembly of HPE products to remove components and materials requiring selective treatment, 
as defined by Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic 
Equipment (WEEE). 

1.0

 

Items Requiring Selective Treatment

 

 1.1 Items listed below are classified as requiring selective treatment. 
 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as   
applicable. 

Item Description 

Notes 

Quantity 
of items 
included 
in 
product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm.  
1 in each of 2 I/O modules (IOMs) 
1 in each of 2 power cooling modules 
1 in 24-HDD baseplane in each of 4 PCBAs 
1 in 10-HDD baseplane 
1 in each of 4 expander riser cards 
1 in each of 8 expanders 
1 in each of 2 passthrough cards 
1 in EBOD PCBA 
1 in midplane PCBA 

25 max 

Batteries 

All types including standard alkaline and lithium 
coin or button style batteries    

Mercury-containing components 

For example, mercury in lamps, display 
backlights, scanner lamps, switches, batteries   

Liquid Crystal Displays (LCD) with a surface 
greater than 100 sq cm 

Includes background illuminated displays with 
gas discharge lamps   

Summary of Contents for Cray Cls 4U 106-10TB

Page 1: ...012 19 EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment WEEE 1 0 Items Requiring Selective Treatment 1 1 Items listed below are classified as requiring selective treatment 1 2 Enter the quantity of items contained within the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in p...

Page 2: ...s print heads tubes vent chambers and service stations 0 Components and waste containing asbestos 0 Components parts and materials containing refractory ceramic fibers 0 Components parts and materials containing radioactive substances 0 2 0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring ...

Page 3: ...cedure 13 Disassemble the chassis See the chassis disassembly procedure 3 2 Optional Graphic If the disassembly process is complex insert a graphic illustration below to identify the items contained in the product that require selective treatment with descriptions and arrows identifying locations 3 2 1 PCM disassembly procedure ss Artesyn PSU RMN 700 014575 XXXX where XXXX can be any alphanumeric ...

Page 4: ...ly 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 2 Remove the three screws and the LED connector from the marked locations and then remove the PCA from the enclosure ...

Page 5: ...MF877 00 Page 5 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 ...

Page 6: ...prise Development LP HPE instructions for this template are available at MF877 01 Bel Power PSU RMN SPASGAT 02 1 Remove the three casing screws shown by the red circles in the images below Free the crimps marked by the yellow boxes using a protruding tool and then pull up the top cover ...

Page 7: ...MF877 00 Page 7 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 ...

Page 8: ... Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 2 Remove the LED connector from the connector marked in the image ...

Page 9: ... Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 3 Remove the four screws from the bottom of the enclosure as marked in the image by the red circles to remove the PCA from the PSU ...

Page 10: ...ard Enterprise Development LP HPE instructions for this template are available at MF877 01 3 2 2 IOM disassembly procedure 1 Remove the EMI Gasket from the metal base 2 Remove the casing screws using a Philips 1 bit and pull the top cover in the direction shown by the red arrows ...

Page 11: ...ewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 3 Use a Philips 1 bit to remove the four screws connecting the PCBA to the metal enclosure 4 Slide the PCBA away from the PSU in the direction shown by the red arrows ...

Page 12: ... Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 5 Remove the heatsink by removing its pushpin To remove a pushpin compress it from the top and use pliers to pull out the other end ...

Page 13: ...ctions for this template are available at MF877 01 3 2 3 Rear fan disassembly procedure 1 Remove the connector from the frame by pushing the connector as shown by the arrows in the image below 2 Remove the six screws as shown in the image below using a Phillips 1 bit Then pull out the metal frame as shown by the arrow ...

Page 14: ... Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 3 Remove the four screws as shown in the image below using a Phillips 1 bit Then remove the fan latch lid as shown by the red arrow ...

Page 15: ...ight 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 4 Remove the eight rubber isolators shown in the image below Then gently remove the fan module from the metal housing as shown by the red arrow ...

Page 16: ...ilable at MF877 01 5 Remove the fan handle by removing the two screws attached to the sheet metal using a Phillips 2 bit 3 2 4 Controller fan disassembly procedure 1 Remove the connector from the fan s sheet metal by sliding the connector in the direction shown by the red arrow and then by pushing it inside in the direction shown by the green arrow ...

Page 17: ...rise Development LP HPE instructions for this template are available at MF877 01 2 Remove the two screws located at the positions marked by the red circles in the image below 3 Remove the eight screws between the outlet sheet metal and the fan unit using a Phillips 2 bit screws not shown ...

Page 18: ...18 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 4 Separate the fan from the metal sheets 5 Remove the fan handle by using a Phillips 2 bit to remove the two screws marked below ...

Page 19: ...nt LP HPE instructions for this template are available at MF877 01 3 2 5 Chassis disassembly procedure 1 Remove the top cover and then remove all the disk drives and controller fans from the chassis 2 Remove the PSUs rear fans and controllers from the chassis using the latches marked in the image below ...

Page 20: ...tructions for this template are available at MF877 01 3 Remove all eight expander cards marked by the red circles Pull the plastic handles the direction as shown by the red arrows in the second image 4 To remove the cable guide by hand or by using a tool slide the metal plate in the direction shown by the red arrow ...

Page 21: ...ove the screws connecting the CML shelf using Philips 1 bit as shown by the red circles 6 Remove each fan connection cable from the chassis by pushing the connector in the direction shown by the green arrow and then removing the connector from the power midplane marked by the red circle 7 Remove the baffle between the power midplane and rear end as shown by the red arrows ...

Page 22: ...rise Development LP HPE instructions for this template are available at MF877 01 8 Remove the ribbon cable connecting the midplane to the IOM passthrough card 9 Use a Philips 1 bit to remove the six screws marked in the image below to remove the PSU divider assembly from the base chassis ...

Page 23: ...hilips 1 bit to remove the three screws marked in the image below from the bottom of the chassis to remove the PSU divider 11 Use a Philips 1 bit to remove the two screws from the top side of the divider assembly to remove the divider 12 Use a Phillips 2 bit to remove the 32 screws from the right side and 20 screws from left side of the base chassis to remove the drive bay wall ...

Page 24: ...ght 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 13 Use a Phillips 2 bit to remove the seven screws from the left edge side of the base chassis to remove the drive bay wall from the base chassis ...

Page 25: ...t to remove the two screws connecting the drive bay to the front base chassis to remove the drive bay wall from the base chassis 15 Use a Phillips 2 bit to remove the 34 screws from the drive bay connecting the drive bay PCBA marked in the image below to remove the drive bay wall from the base chassis The below image is marked for the first row screw location Repeat this step for each row ...

Page 26: ...ructions for this template are available at MF877 01 16 Remove the drive bay wall assembly from the base chassis by pulling it upward as shown below 17 Rotate the slide support bar from the drive bay assembly at a 45 degree angle to the horizontal plane until the bar moves freely and then pull the bar as shown below ...

Page 27: ...ions for this template are available at MF877 01 18 To disassemble the wall bay assembly remove the screws marked in red connecting the metal plate using a Philips 2 and Philips 1 bits 19 To remove the top stabilizer from the walls slide the stabilizer as shown in the direction shown below Repeat this step for all walls ...

Page 28: ...his template are available at MF877 01 20 Remove the top insulation sheet in the direction shown by the red arrows 21 Remove the 12 screws red circled in the image from the 24 HDD baseplane using a Philips 2 bit Then remove the eight screws yellow circled connecting the 24 HDD baseplane PCBA to the buss bar using a Philips 2 bit ...

Page 29: ... 24 HDD baseplanes as marked by red arrows to remove them from the expander riser cards 23 Remove the three screws circled red below from the base chassis using a Philips 2 bit 24 Remove the high speed connector cable marked with red arrows and the connector connecting the 10 HDD baseplane to the EBOD PCBA marked with green arrows Remove the 10 HDD baseplane from the base chassis ...

Page 30: ...nterprise Development LP HPE instructions for this template are available at MF877 01 25 Remove the foam divider fitted into PEM holes 26 Remove the high speed cable connecting the passthrough card and 10 HDD baseplane by pulling the cable from the connector as shown by the red arrow ...

Page 31: ...rise Development LP HPE instructions for this template are available at MF877 01 27 Remove the passthrough front PCBA by using a Phillips 1 bit to remove the four screws circled red 28 Remove the front passthrough card connecting connector by pulling up the PCBA as shown by the red arrow ...

Page 32: ...opment LP HPE instructions for this template are available at MF877 01 29 Remove the four standoffs by hand or by using a wrench 30 Remove the high speed cable connector by pulling it as shown by the red arrow and remove the second passthrough card by pulling up the PCBA as shown by the green arrow ...

Page 33: ...yright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 31 Use a Phillips 1 bit to remove the four screws on the PEMs 32 Remove the cables from the expander riser card as shown in the image below ...

Page 34: ...lable at MF877 01 33 Remove the EBOD PCBA by using a Phillips 1 bit to remove the six screws circled red and using a Phillips 2 bit to remove the two screws circled yellow 34 Remove the midplane PCBA by using a Phillips 2 bit to remove the five screws circled red connecting base sheet metal and the eight screws circled yellow connecting the buss bar ...

Page 35: ...ard from the base metal chassis by using a T10 bit to remove the six screws circled red from the expander riser card Repeat this step for all the remaining expander riser cards and remove all the PCBAs from the chassis 36 Use a Phillips 1 bit to remove the SAS expander guide from the chassis 37 Remove the side handles by using a Phillips 2 bit to remove the screws marked below Repeat on both sides...

Page 36: ...re mounted from inside chassis Remove the three screws marked below from the inside chassis and slide as indicated by the green arrows to release from the T pins OR If the rails are mounted externally Remove the five screws from the marked position that holds the inner rail then slide as indicated by the green arrows to release from the T pins Repeat this step for the right inner rail ...

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